Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Jingdao Microelectronics MB2S
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic MB2S
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- MB2S
- Electronic Component
- 1
- Package
- MBS
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.213g
- Electronic Component
- 1
- Electronic Component
- BM0227664029
- Current
- 800mA
- Current(Ir)
- 5uA@200V
- (Vf)
- 1.1V@800mA
- Electronic Component
- 55℃~+150℃@(Tj)
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MB2S 单相整流桥 产品概述
一、产品简介
MB2S 是晶导微电子推出的一款单相整流桥，采用紧凑的 MBS 封装，集成四只二极管以实现全波整流。该器件适用于小功率开关电源、适配器、LED 驱动与一般家电控制电路，能在空间受限的板级设计中简化布局与装配。
二、主要参数
- 工作结温范围：-55℃ ~ +150℃ (Tj)
- 正向压降：Vf = 1.1V @ If = 800mA
- 整流电流：If(AV) = 800mA
- 非重复峰值浪涌电流：Ifsm = 30A（短时冲击）
- 直流反向耐压：Vr = 200V
- 反向电流：Ir = 5µA @ Vr = 200V
- 类型：单相整流
三、特性与优势
- 低正向压降：1.1V（800mA）减小整流损耗，有利于提高效率并降低发热。
- 低漏电流：5µA@200V，适合对漏电敏感的高压应用与待机功耗优化。
- 良好浪涌能力：30A 的短时峰值浪涌抗扰性，可承受启动或短时冲击电流。
- 宽温工作范围：-55℃ 至 +150℃，满足严苛环境下的可靠性要求。
- 集成化封装（MBS）：节省 PCB 布局空间，装配简便。
四、典型应用场景
- 小功率开关电源与适配器的输入整流与续流。
- LED 驱动电路的桥式整流与整流滤波。
- 家用电器控制板、计量与传感器电源模块。
- 电池充电器与去耦电路中作为整流元件。
五、使用与热设计建议
- 损耗估算：在 If = 800mA 时，整流功耗约 Pd ≈ Vf × If = 1.1V × 0.8A ≈ 0.88W，需考虑散热措施。
- 降额建议：在自然冷却条件下建议将长期工作电流控制在额定值的 70%~80% 以下，并保证结温低于 125℃ 以延长寿命。
- PCB 布局：增大封装下方及输出侧的铜箔面积，采用多层走铜或加热沉板，并在高密度布板处布置热孔与热过孔以提高散热。走线尽量短且截面足够以降低额外发热。
- 浪涌注意：Ifsm = 30A 为非重复峰值浪涌能力，仅用于短时冲击（如启动或故障情形），不宜长期反复依赖，必要时配合限流电阻或NTC、保险丝等保护元件。
六、选型与可靠性注意事项
- 若电路存在持续高纹波电流或较大温升，应选型更大电流能力或低 Vf 的器件。
- 对于需要更高阻断电压或更低漏电流的应用，可考虑更高 Vr 或低 Ir 的型号。
- 在高海拔、潮湿或强电磁干扰环境中，应增加保护与封装防护措施以保证长期稳定工作。
晶导微电子 MB2S 以其低压降、低漏电与良好浪涌承受力，适合多种小功率整流场景。合理的热设计与适当的电流降额能显著提升系统可靠性与寿命。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
