WMSIC Electronic Components

Jingdao Microelectronics SMBJ22A

ModelSMBJ22A
PackageSMB
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic SMBJ22A
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
SMBJ22A
Electronic Component
1
Package
SMB
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.167g
Electronic Component
1
Cj- Capacitor
390pF
Electronic Component
BM0230856411
Operating Temperature
65℃~+150℃
Voltage
35.5V
Current(Ir)
1uA
Voltage(VBR)
26.9V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMBJ22A LX — 产品概述

一、产品简介

SMBJ22A LX 是晶导微电子推出的一款 SMB 封装瞬态电压抑制二极管(TVS),为对抗雷击、浪涌和开关瞬态提供高能量吸收能力的保护元件。该器件为单向保护,反向工作电压(Vrwm)为22V,适用于24V及以下直流系统的过压浪涌防护。

二、主要性能参数

  • 钳位电压(Vc): 35.5V(典型,按10/1000μs脉冲条件)
  • 击穿电压(Vbr): 26.9V
  • 反向截止电压(Vrwm): 22V
  • 峰值脉冲功率(Ppp): 600W @ 10/1000μs
  • 峰值脉冲电流(Ipp): 16.9A @ 10/1000μs
  • 结电容(Cj): 390pF
  • 反向电流(Ir): 1μA(在 Vrwm 条件下典型)
  • 工作温度范围: -65℃ ~ +150℃
  • 封装: SMB(表面贴装)

三、产品特点与优势

  • 高脉冲吸收能力:在标准10/1000μs波形下可承受600W峰值脉冲能量,能够有效吸收雷击或开关瞬态能量。
  • 低反向漏电流:典型反向电流仅1μA,适合对漏电敏感的系统。
  • 宽温度适应性:-65℃至+150℃的工作范围,满足工业级与严苛环境应用需求。
  • 标准SMB封装:体积小、便于自动贴装和现场更换,适合批量生产与维修。

四、典型应用场景

  • 汽车电子(适用于12V/24V线束过压保护)
  • 工业电源和配电设备的浪涌抑制
  • 通信电源、开关电源输入端保护
  • 电机驱动及继电器、接触器等开关瞬态抑制

五、使用建议与电路布局注意事项

  • 保护元件应尽量靠近被保护的端口或连接器放置,缩短走线以减小串联电感和寄生电阻。
  • 接地回路应低阻、短且宽,必要时在SMB焊盘下使用多箔层过孔铺铜以提升散热能力。
  • 由于结电容约390pF,SMBJ22A 不适合对高频高速信号线(如USB3.0、GbE差分对)做直接并联保护,以免影响信号完整性;可优先用于电源线和低速控制信号。
  • 对于需要更高能量承受或重复浪涌场合,可考虑并联或使用更高规格的浪涌抑制器,但需注意并联时电流分配可能不均。

六、可靠性与选型提示

在选型时应确认系统正常工作电压不接近 Vrwm,以避免误触发或持续泄露;如系统可能出现长期偏高电压,应适当留有余量(通常选用 Vrwm 高于最大工作电压 20% 左右)。在高温或连续冲击环境下,应关注封装热阻和PCB散热,必要时采用热沉或更大封装型号以提高寿命与可靠度。

如需进一步的电气曲线、封装尺寸图纸或可靠性测试数据,可联系晶导微电子获取详细器件资料与应用指导。

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