Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Jingdao Microelectronics ES1DW
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic ES1DW
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- ES1DW
- Electronic Component
- 1
- Package
- SOD-123F
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0226519489
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 5uA@200V
- (Vf)
- 1V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ES1DW 产品概述 — 晶导微电子
一、产品简介
ES1DW 是晶导微电子推出的一款独立式快恢复/高效率整流二极管，面向通用整流和开关电源应用。器件采用 SOD-123F 小型表面贴装封装，兼顾高速恢复特性与较低正向压降，适用于体积受限且对开关损耗敏感的电源电路。
二、主要特点
- 独立式单个二极管设计，便于并联或单独使用。
- 快恢复特性，反向恢复时间 Trr ≈ 35 ns，有利于降低开关损耗和系统电磁干扰。
- 低正向压降：Vf = 1.0 V @ 1 A，减小导通损耗，提高效率。
- 额定整流电流：1 A，满足一般小功率整流需求。
- 非重复峰值浪涌电流 Ifsm = 30 A，具备一定的冲击承受能力。
- 反向耐压 Vr = 200 V，反向电流 Ir = 5 μA @ 200 V，适合中压直流/开关电源前端整流。
三、电气性能（典型/额定值）
- 型号：ES1DW（晶导微电子）
- 封装：SOD-123F（表面贴装）
- 正向压降：1.0 V @ IF = 1 A
- 最大整流电流：IRRM（整流电流） = 1 A（连续）
- 非重复峰值浪涌电流：Ifsm = 30 A（单次冲击）
- 直流反向耐压：Vr = 200 V
- 反向电流：Ir = 5 μA @ 200 V
- 反向恢复时间：Trr = 35 ns
- 工作结温范围：Tj = -55 ℃ ~ +150 ℃
（注：以上数值为典型/额定测试条件下所得，实际使用请参照完整数据手册和应用条件进行热和电流散热评估。）
四、典型应用场景
- 开关电源（SMPS）输出整流或回收路径
- 适配器、充电器、消费类电子电源整流
- 电机驱动及电源滤波电路中的高频整流
- 逆变器、太阳能微型逆变模块的中低功率整流段
- 任何需兼顾快速恢复与较低正向压降的通用整流场景
五、封装与热管理
SOD-123F 封装体积小、适合自动贴装，但因体积限制器件的散热能力有限。设计 PCB 布局时建议：
- 在焊盘背面或附近增加铜箔面积以提升散热；
- 对于接近额定电流工作，考虑使用热过孔或连接到散热层；
- 在高脉冲或高浪涌应用中评估瞬态温升，必要时并联或选用更高规格器件。
六、使用与储存注意事项
- 焊接建议遵循器件的回流焊温度限制和曲线（参考完整数据手册）。
- 防静电、防潮包装储存；开封后如为贴片盘，建议在规定时间内回流焊接完成。
- 在高温、高湿或强振动环境下，应根据应用做可靠性评估。
如需完整的电气特性曲线、热阻、焊接曲线和封装尺寸图，请联系晶导微电子索取完整数据手册或技术支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
