WMSIC Electronic Components

Jingdao Microelectronics SS510C

ModelSS510C
PackageSMC(DO-214AB)
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic SS510C
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
SS510C
Electronic Component
1
Package
SMC(DO-214AB)
Electronic Component
Schottky Diode
Electronic Component
0.401g
Electronic Component
1
Electronic Component
BM0230630455
Current
5A
Diode
Electronic Component
Current(Ir)
1mA@100V
(Vf)
850mV@5A
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS510C(SMC 肖特基二极管)产品概述

一、产品简介

SS510C 是晶导微电子推出的一款独立式肖特基整流二极管,封装为 SMC (DO-214AB)。肖特基结构使其具有低正向压降和极短的恢复时间,适合中大电流整流和开关电源中的回收、续流保护等应用。器件极性清晰,封装耐处理,适用于工业级电源设计。

二、主要电气参数

  • 器件型号:SS510C
  • 封装:SMC (DO-214AB),独立式(单颗)
  • 整流电流(IF):5A(连续)
  • 正向压降(Vf):0.85 V @ IF = 5A
  • 直流反向耐压(Vr):100 V
  • 反向电流(Ir):1 mA @ VR = 100 V
    以上参数为典型/标称值,具体设计请参考完整数据手册并考虑温度对漏电和正向压降的影响。

三、性能特点与使用要点

  • 低正向压降:0.85 V 在 5A 时可显著降低整流损耗,相比普通 PN 二极管能减小功耗和升温。
  • 反向漏电:在 100 V 时反向电流约为 1 mA,肖特基二极管的漏电随温度上升敏感,需注意高温工作下的泄漏电流影响。
  • 快速恢复:肖特基结构几乎无显著反向恢复,适合高频开关场合做续流或整流。
  • 热管理要求:5A 运行下正向耗散约为 4.25 W(P = IF × Vf),须做好 PCB 铜箔散热或加散热片以保持结温在安全范围内。
  • 极限参数:请遵循最大结温与冲击电流规范,避免长期在极限条件下工作以延长寿命。

四、典型应用场景

  • 开关电源(SMPS)次级整流
  • 电机驱动与续流二极管
  • 车载电源与电池保护(需考虑温度与漏电特性)
  • 电源 OR-ing 与反向保护
  • 太阳能逆变器辅助整流及防反灌

五、封装与 PCB 布局建议

  • SMC 封装面积与导热能力较好,建议在器件下方和相邻铜区留出大面积散热铜箔,并结合过孔(via)下穿至内部或反面大面积铜箔进行热传导。
  • 引脚走线最短且宽,降低寄生阻抗与热阻;在高频应用旁路电容靠近二极管放置以抑制尖峰。
  • 在布局时注意器件方向标识(阴极带),确保电路连接与极性正确。

六、选型与可靠性建议

  • 若工作电压或温度更高,应评估更高 Vr 或更低 Ir 的器件;若对漏电敏感(小电流系统),注意肖特基的温漂特性。
  • 设计时考虑热降与平均功率损耗的裕量,并按照典型波形验证浪涌与峰值电流承受能力。
  • 采购与检验建议从正规渠道获取晶导微电子原装件,参考完整数据手册进行温度、寿命与封装尺寸核对。

如需进一步的热阻、最大结温、冲击电流或封装尺寸图,请提供要求,我可依据器件手册给出更详细的设计建议。

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