Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Jingdao Microelectronics S1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic S1G
- Type
- Jingdao Microelectronics
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- S1G
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.122g
- Electronic Component
- 1
- Electronic Component
- BM0222180940
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 5uA@400V
- (Vf)
- 1.1V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
S1G 产品概述
一、产品介绍
S1G 是一款由晶导微电子（GRED）推出的通用二极管，采用独立式的 SMA (DO-214AC) 封装设计，具有广泛的应用场景和优良的电气特性。其特性包括在 1A 的电流下，正向导通电压为 1.1V，反向耐压可达 400V，使其成为电力电子、开关电源、整流电路以及其他高压应用的理想选择。
二、主要技术参数
- 正向电压降（Vf）：1.1V @ 1A
- 额定电流（If）：1A
- 反向复位电压（Vr）：400V
- 封装类型：SMA (DO-214AC)
- 工作温度范围：-55°C 至 +150°C
这些参数展示了S1G 在高压和高电流情况下的可靠性和性能，尤其是在需要有效阻断反向电流的应用中。
三、封装特点
SMA（DO-214AC）封装为表面贴装（SMD）元件，具有较小的尺寸和优良的散热性能。该封装的体积小巧，方便与其他电子元器件一同集成，适合在空间有限的小型电路板上使用。此外，SMA 封装还提供了良好的焊接性和机械稳定性，适合大规模自动化生产。
四、应用领域
S1G 二极管的广泛应用包括但不限于以下几个领域：
- 开关电源：作为整流二极管，用于将交流电转换为直流电，是开关电源中重要的组件之一。
- 电机驱动：在电动机电路中，S1G 可用作续流二极管，保护电路并确保高效的电流控制。
- 保护电路：在各种电子设备中，S1G 可用于防止反向电流，保护其他敏感元件。
- 信号整流：在通信设备和其他低信号处理电路中，S1G 的低正向电压降，使其在信号整流上表现出色。
五、技术优势
使用 S1G 二极管的主要优势包括：
- 高效能：在高温和高电流条件下，S1G 能够维持较低的正向电压降，减少功耗，提高系统的整体效率。
- 高可靠性：其高反向耐压和宽工作温度范围确保了在苛刻环境下的稳定性和长期可靠性，适合在工业环境中使用。
- 紧凑设计：由于 SMA 封装的设计特性，S1G 适合于小型化产品设计，节省空间和材料成本。
六、结论
总的来说，S1G 是一款性能优异、应用广泛的通用二极管，特别适合于需要高压和高电流的应用。无论是在开关电源、工业控制系统还是消费电子产品中，S1G 都能够提供可靠的电气特性和稳定的性能。随着电力电子技术的迅猛发展，选择一款像 S1G 这样的高性能二极管无疑将为电子设计带来更多的设计灵活性和系统效能的提升。晶导微电子凭借其过硬的技术积累和市场经验，为广大客户提供了一个值得信赖的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
