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Jingdao Microelectronics S6MC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic S6MC
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- S6MC
- Electronic Component
- 1
- Package
- SMC(DO-214AB)
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.381g
- Electronic Component
- 1
- Electronic Component
- BM0230630737
- Current
- 6A
- Diode
- Electronic Component
- Current(Ir)
- 5uA@1000V
- (Vf)
- 1.15V@6A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
S6MC 通用整流二极管 — 产品概述
一、产品简介
S6MC 是晶导微电子推出的一款独立式通用整流二极管，采用 SMC (DO-214AB) 封装。器件额定整流电流为 6A，直流反向耐压（Vr）为 1kV，正向压降 Vf 为 1.15V（IF=6A），在高压整流与一般功率电子应用中具有良好的电气性能与可靠性。工作结温范围宽 (-55℃ ~ +150℃)，适用于多种工业和商用场景。
二、主要性能特点
- 额定整流电流：6A（独立式单颗二极管）
- 直流反向耐压：1000V（耐高压整流）
- 正向压降：1.15V @ IF=6A（低损耗设计，有利于降低功耗）
- 反向漏电流：5µA @ VR=1000V（在高电压下保持低漏流）
- 工作结温：-55℃ ~ +150℃（高温可靠性）
- 标准 SMC (DO-214AB) 封装，便于自动化贴装与焊接
三、典型应用场景
- 高压整流桥与单相/三相整流电路
- 开关电源（SMPS）输出整流或次级整流
- 变频器、逆变器与电机驱动的保护与回流路径
- UPS、充电器与照明驱动电源
- 工业电源、测控设备和高压供电模块
四、使用与设计注意事项
- 热管理：尽量将器件焊接到带有足够铜箔面积的 PCB（必要时使用散热片或多层热过孔），在高电流工况下做适当降额。
- 温度影响：反向漏电流会随结温上升而增加，设计时预留安全裕量。
- 开关与浪涌：对有高速切换或较大浪涌的应用，建议在系统中加入合适的限流/吸收电路（如 RC 吸收、TVS）以保护二极管。
- 极性识别：SMC 封装通常在管体上有阴极标记（带），焊接时注意方向性。
- 焊接工艺：遵循生产厂家的焊接与回流温度规范，避免长时间高温暴露以保证长期可靠性。
五、封装与可靠性
SMC (DO-214AB) 为业界通用的功率二极管封装，机械强度高，适合波峰/回流焊与手工焊接。器件在 -55℃ 至 +150℃ 的工作结温范围内保持稳定性能，适合工业级环境。为保证长期可靠性，建议在高温或高湿环境下配合防潮措施与合适的热管理设计。
六、订购信息与型号说明
- 品牌：晶导微电子
- 型号示例：S6MC（独立式，SMC 封装）
- 在选型与采购时，请确认具体的零件编号、出厂测试报告与包装形式（卷带、盘装或散装），并参考晶导微电子的最新规格书以获取完整的绝对最大额定值、热阻、封装尺寸与焊接工艺说明。
如需基于 S6MC 的电路示例、热仿真建议或更详细的规格参数（如反向恢复时间、结到引脚热阻等），可提供使用场景与工作工况以便给出更有针对性的设计建议。
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