WMSIC Electronic Components

Jingdao Microelectronics SMF10A

ModelSMF10A
PackageSOD-123FL
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic SMF10A
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
SMF10A
Electronic Component
1
Package
SOD-123FL
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0230630453
Operating Temperature
55℃~+150℃
Voltage
17V
Current(Ir)
2.5uA
Voltage(VBR)
12.3V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF10A TVS 二极管(10V)产品概述

一、产品简介

SMF10A 是晶导微电子推出的一款瞬态电压抑制(TVS)二极管,采用紧凑型 SOD-123FL 封装,专为瞬态过压和浪涌保护设计。该器件适用于需要在 10V 额定工作电压下保护电源线、信号线及敏感芯片免受雷击、开关瞬变及静电放电等冲击的应用场景。

二、主要电气参数

  • 反向截止电压 (Vrwm):10V
  • 击穿电压 (Vbr):12.3V
  • 钳位电压 (Vclamp):17V(在指定脉冲条件下)
  • 峰值脉冲电流 (Ipp):11.8A
  • 峰值脉冲功率 (Ppp):200W(10/1000 μs 波形)
  • 反向泄漏电流 (Ir):2.5 μA
  • 工作温度范围:-55℃ 至 +150℃

三、产品优势与特点

  • 抗浪涌能力强:Ppp=200W(10/1000 μs),可承受高能量脉冲,适合电源线和总线防护。
  • 低漏电流:Ir 仅 2.5 μA,有利于低功耗系统长期在线保护。
  • 紧凑封装:SOD-123FL 体积小,便于表面贴装(SMT),节省 PCB 空间。
  • 宽温度范围:-55℃~+150℃,适应工业级和车规级要求(具体车规资格请参照厂方认证资料)。

四、典型应用场景

  • 工业控制和自动化电源防护
  • 汽车电子局部电路(需结合车规认证确认)
  • 通信设备、基站电源输入保护
  • 消费电子产品中的电源与接口浪涌抑制
  • 电池管理、充电器及 USB/数据线防护

五、封装与可靠性

SOD-123FL 封装利于自动贴装与回流焊工艺,热阻和机械强度适合一般工业应用。实际可靠性与使用寿命受工作环境、浪涌频次和 PCB 散热设计影响,建议结合实际系统做加速老化或浪涌测试验证。

六、使用建议

  • 布局时将器件尽可能靠近被保护端口,缩短引线与走线长度以降低感抗。
  • 设计时留有足够的安全裕量:Vrwm(10V)为器件长期耐压值,系统工作电压不应接近该值。
  • 对于频繁遭受高能冲击的场合,宜配合熔断器或限流元件使用以提高整体可靠性。
  • 焊接与回流工艺参照晶导微电子的封装与工艺指南,以避免热应力损伤。

如需器件完整数据手册、PCB 布局建议或样片测试结果,可提供进一步支持。

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