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Jingdao Microelectronics MM1Z5V1BW
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic MM1Z5V1BW
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- MM1Z5V1BW
- Electronic Component
- 1
- Package
- SOD-123W
- Electronic Component
- Zener Diode
- Electronic Component
- 0.033g
- Electronic Component
- 1
- (Zzt)
- 130Ω
- Electronic Component
- BM0265390937
- Diode
- 1
- Current(Ir)
- [email protected]
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 5V~5.2V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MM1Z5V1BW稳压二极管产品概述
一、产品基本定位与身份标识
MM1Z5V1BW是晶导微电子推出的独立式低压稳压二极管，属于通用型基准电压器件。型号中“Z”明确稳压管属性，“5V1”对应标称稳压值5.1V，主要针对消费电子、工业控制等领域的小型化电路设计，适配对空间、功耗有严格要求的场景。
二、核心电气性能参数
该器件的关键参数直接决定应用适配性，具体如下：
- 稳压值（Vz）：标称5.1V，允许波动范围5.0V~5.2V，精度满足多数低压电路的基准需求，无需额外校准即可用于一般场景；
- 反向漏电流（Ir）：反向偏置1.5V时最大漏电流仅2μA，低漏电流特性显著降低待机功耗，适合电池供电的便携式设备；
- 最大耗散功率（Pd）：500mW，即器件允许的瞬时最大功率损耗，实际使用需通过限流电阻控制工作电流（如电流≤100mA时，功率损耗≤510mW，需预留余量）；
- 动态阻抗（Zzt）：典型值130Ω，反映电流波动对电压的影响——电流变化1mA时，电压波动约0.13mV，可有效抑制电源纹波干扰。
三、封装设计与物理特性
采用SOD-123W表面贴装封装，具备以下优势：
- 尺寸紧凑：封装尺寸约2.0mm×1.25mm×1.0mm，比传统直插封装节省70%PCB空间，适配高密度布局；
- 焊接兼容性：支持回流焊、波峰焊等常规工艺，焊接峰值温度可达260℃（持续≤10s），符合电子制造标准；
- 环境耐受性：封装材料为耐高温环氧树脂，抗冲击、抗潮湿性能优异，工作温度范围-55℃~+150℃，覆盖常规工业与消费电子场景。
四、品牌背景与可靠性保障
晶导微电子是国内半导体分立器件主流厂商，专注稳压管、MOS管等器件研发，产品通过ISO9001认证，部分系列符合AEC-Q101汽车级标准。MM1Z5V1BW出厂前需经全参数测试、老化筛选，确保批量一致性与长期稳定性。
五、典型应用场景
- 低压电源稳压：作为线性/开关电源的基准源，稳定5V输出，常见于手机充电器、智能穿戴电源模块；
- 过压保护：与限流电阻串联后并联在MCU、传感器等敏感元件两端，输入电压超5.2V时导通，限制元件端电压；
- 模拟电路基准：用于ADC/DAC的参考电压，满足12位转换器对±0.1%精度的要求；
- 小型设备：适配遥控器、蓝牙耳机、智能门锁等便携式设备的电源稳压环节，利用小封装与低功耗适配空间限制。
六、使用注意事项
- 工作状态：必须工作在反向击穿区（电压达稳压值），正向偏置无稳压功能；
- 功率限制：实际耗散功率≤500mW，建议串联限流电阻（如电流50mA时，电阻≥(输入电压-5.1V)/0.05A）；
- 焊接规范：手工焊接温度≤350℃、时间≤3s，避免封装损坏；
- 存储防护：未焊接器件需存于干燥环境（湿度≤60%），操作需防静电。
该器件凭借稳定的电气性能、紧凑封装与可靠品牌保障，成为低压稳压场景的高性价比选择。
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