WMSIC Electronic Components

Jingdao Microelectronics MM1W3V3

ModelMM1W3V3
PackageSOD-123
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic MM1W3V3
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
MM1W3V3
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.036g
Electronic Component
1
(Zzt)
10Ω
Electronic Component
BM0093178802
Diode
1
Current(Ir)
100uA
Power Dissipation(Pd)
1W
Electronic Component
3.1V~3.5V
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MM1W3V3 产品概述

产品概述

MM1W3V3 是一种独立式稳压二极管,由晶导微电子公司生产品。该器件被设计用于提供稳定的电压输出,尤其适合需要在3.3V工作电压下运行的应用。其工作电压范围在3.1V至3.5V之间,确保了在各种电源波动情况下一致的表现。

主要特性

  1. 稳压功能:MM1W3V3 的主要功能是稳压,这使其在电源管理中扮演着重要角色。它能够有效地对电压进行限制,确保后续电路获得相对稳定的电压供应,从而降低电路因电压变化而导致的故障风险。

  2. 低功耗特性:该器件在1V电压下的工作电流为100uA,意味着其功耗非常低。对于现代电子设备,尤其是便携式设备和电池供电设备来说,低功耗特性是设计时的重要考虑因素。

  3. 封装优势:MM1W3V3 采用SOD-123封装,这种小型化封装减少了占用空间,便于与其他元件协同工作,适合高集成度的电路设计。SOD-123封装还具有良好的散热性能,有利于提高元件的可靠性。

  4. 温度稳定性:该稳压二极管在一定的温度范围内维持其电压特性,适用于不同工作环境下的电子设备。温度变化不会显著影响它的性能,适合需要高可靠性的应用场景。

应用场景

MM1W3V3 广泛应用于各类电子产品中,特别是对电压有严格要求的微处理器、数字电路及模拟电路等。其典型应用场景包括:

  • 消费电子:如智能手机、平板电脑、智能手表等,在这些设备中,稳压二极管用于给各种集成电路提供稳定的工作电压。

  • 通信设备:用于基站、路由器及其他网络设备,确保通信模块的正常运行,从而提高信号传输的可靠性。

  • 工业控制:在工业设备和自动化系统中,稳压二极管帮助提供必要的电源保护,保证设备在较高或较低的电源条件下依然正常工作。

  • 汽车电子:随着现代汽车对电子设备依赖的加深,MM1W3V3 可用于车载电子系统中,例如导航仪、车身控制单元等,确保电器设备的稳定性。

结论

综上所述,MM1W3V3 稳压二极管是一个性能优良、封装紧凑的电子元器件,适合各种对电源电压要求严格的应用场合。凭借其低功耗、高稳定性及良好的温度适应能力,MM1W3V3 深受设计人员的青睐。无论是在消费类电子产品还是工业应用中,其可靠性和性能均表现出色,为电路设计和系统稳定性提供了有力保障。在不断发展的电子设备和应用需求下,MM1W3V3 作为一种基本而重要的元器件,将继续发挥其重要作用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.