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Jingdao Microelectronics FR104W
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic FR104W
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- FR104W
- Electronic Component
- 1
- Package
- SOD-123F
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0229356801
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 5uA@400V
- (Vf)
- 1.3V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
晶导微电子 FR104W 产品概述
一、产品简介
FR104W 是晶导微电子推出的一款独立式快恢复/高效率整流二极管，采用小型 SOD-123F 封装。器件在 1A 工作电流条件下正向压降仅为 1.3V，同时具备 400V 的直流反向耐压和较低的反向漏电流，适用于各类中低功率开关电源、功率因数校正、电源轨保护及续流整流等应用场合。
二、主要参数与特性
- 二极管配置：独立式
- 直流反向耐压 Vr：400V
- 正向压降 Vf：1.3V @ IF = 1A
- 额定整流电流 IF(AV)：1A
- 反向电流 Ir：≤5 μA @ Vr = 400V
- 反向恢复时间 Trr：150 ns（快恢复特性，降低开关损耗）
- 非重复峰值浪涌电流 Ifsm：30A（可承受短时冲击）
- 工作结温范围：-55℃ ~ +150℃（Tj）
- 封装：SOD-123F（小体积、易于表面贴装）
三、性能亮点
- 快恢复特性：150ns 的反向恢复时间可显著降低开关阶段的反向恢复引起的能量损耗和电磁干扰，相较传统慢恢复二极管效率更高。
- 低漏电：在满压 400V 条件下漏电仅 5 μA，有利于提高高压侧待机效率和降低损耗。
- 抗冲击能力：30A 的峰值浪涌容限使器件在启动与突发过载时具有良好鲁棒性。
- 宽温区稳定性：-55℃ 至 +150℃ 的结温范围，适应广泛的工业环境。
四、典型应用场景
- 开关电源（SMPS）整流与续流二极管
- 功率因数校正（PFC）回路的整流器
- 适配器、充电器的输出整流/保护
- 工业电源、白色家电及照明电源中的高压整流场合
五、封装与热管理建议
SOD-123F 封装体积小、适合高密度贴装，但热阻较大，建议在 PCB 设计时：
- 在二极管下方及周围增加铜箔散热面积，必要时与热垫相连。
- 为降低结温，应保证实际工作环境中整流电流与器件的功耗匹配，避免长期在额定极限附近运行。
- 焊接工艺遵循厂家推荐回流曲线，防止过热影响可靠性。
六、选型与使用注意
- 若系统追求更低正向压降（更高效率）且允许较高反向电压，可考虑 Schottky 二极管；若要求耐压高且需快恢复特性，FR104W 为平衡之选。
- 在高频开关应用中，应结合 Trr 与开关频率评估开关损耗及 EMC 影响。
- 选型时关注实际浪涌波形与 Ifsm 额定值的匹配，必要时增加软启动或限流保护。
总结：FR104W 以其 400V 耐压、1.3V@1A 的较低正向压降、150ns 快恢复时间以及小型 SOD-123F 封装，为中低功率开关场合提供了性能与尺寸的良好平衡，适合需要兼顾效率、耐压和成本的应用。若需完整电气特性曲线与封装尺寸图，请参阅晶导微电子官方技术资料。
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