Model & package intelligence
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Jingdao Microelectronics SMF8.0CA
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic SMF8.0CA
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- SMF8.0CA
- Electronic Component
- 1
- Package
- SOD-123FL
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Electronic Component
- BM0227664054
- Voltage
- 13.6V
- Current(Ir)
- 25uA
- Voltage(VBR)
- 9.83V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMF8.0CA（8V）TVS二极管 — 产品概述
一、产品简介
SMF8.0CA 是晶导微电子推出的一款单路（单向）瞬态电压抑制器（TVS）二极管，封装为 SOD-123FL，专为抑制雷击、浪涌和电气快速瞬变（EFT）所产生的过电压脉冲而设计。器件响应迅速、封装紧凑，适用于空间受限且要求高可靠性的电源与信号保护场合。
二、主要电气参数
- 钳位电压（Vc，典型）：13.6 V（在 10/1000 µs 测试波形下）
- 击穿电压（VBR）：9.83 V
- 反向截止电压（Vrwm）：8 V（最大工作反向电压）
- 峰值脉冲功率（Ppp）：200 W（10/1000 µs 波形）
- 峰值脉冲电流（Ipp）：14.7 A（10/1000 µs 波形）
- 反向漏电流（Ir）：25 µA（在 Vrwm 条件下）
- 通道数：单路（单向 TVS）
- 类型：TVS 二极管，单向抑制器
- 封装：SOD-123FL
三、产品特性与优势
- 响应速度快：在过电压出现时能在纳秒级别动作，迅速将能量钳位，保护后端器件；
- 能量吸收能力强：200 W（10/1000 µs）脉冲功率承受能力，适应常见雷击/浪涌工况；
- 低漏电流：典型 Ir 为 25 µA，有利于不增加电路静态功耗；
- 紧凑封装：SOD-123FL 适合表面贴装，利于自动化生产与空间受限设计；
- 单向保护：适用于有明确极性要求的直流电源轨或带方向性的信号线。
四、典型应用
- DC 保护：适合用于 8 V 及以下电源轨的浪涌保护，如工业控制电源、通讯设备电源输入；
- 接口保护：用于 USB、串口、CAN 等接口的浪涌与静电抑制（需结合电路实际工作电压选择）；
- PCB 系统保护：配合滤波与限流元件，用于主板、电源模块、模块化设备的顶级防护。
五、选型与使用建议
- 工作电压匹配：Vrwm=8 V，适用于电路正常工作电压不超过此值的场合；若系统工作电压高于 8 V，应选择相应 Vrwm 更高的型号；
- 布局建议：将 TVS 近距离布置于被保护节点与地之间，走线尽量短、宽，焊盘良好接地以保证高频脉冲回流路径最短；
- 热管理与寿命：在频繁浪涌工况下注意器件发热与能量累计，必要时配合熔断器或限流电阻以提高系统可靠性；
- 组合防护：对高速信号线或更严苛雷击环境，建议与共模电感、浪涌抑制器等联合使用，提升整体抗扰度。
六、可靠性与合规
晶导微电子出品，适合自动化贴装与量产应用。建议在批量使用前，根据实际系统环境做浪涌、ESD 和热循环等可靠性验证，确保长期稳定运行。
如需进一步的封装外形尺寸、焊接工艺建议或样片与报价信息，可提供详细需求以便获取对应资料。
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