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Jingdao Microelectronics SS16F
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic SS16F
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- SS16F
- Electronic Component
- 1
- Package
- SMAF
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.056g
- Electronic Component
- 1
- Electronic Component
- BM0228061663
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 300uA@60V
- (Vf)
- 700mV@1A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS16F 产品概述
一、产品简介
SS16F 是晶导微电子推出的一款肖特基整流二极管，额定整流电流为 1A，直流反向耐压 60V。器件工作结温范围为 -55℃ 至 +125℃，采用 SMAF 表面贴装封装，适配现代自动化贴装与回流焊工艺。凭借低正向压降和较小的开关损耗，适用于中小功率电源及保护电路。
二、主要电气参数
- 正向压降 Vf：700mV @ 1A（低压降有助于降低导通损耗）
- 非重复峰值浪涌电流 Ifsm：30A（短时浪涌能力，可承受启动或冲击电流）
- 直流反向耐压 Vr：60V（适用于 12V、24V 及类似母线电压系统）
- 反向电流 Ir：300µA @ 60V（在高压下反向泄漏较低，有利于待机能耗控制）
- 连续整流电流：1A
- 工作结温：-55℃ ~ +125℃
三、产品特点
- 低正向压降：减小导通损耗与发热，提升效率与散热裕度。
- 快速恢复特性：肖特基结带来低反向恢复时间，降低开关损耗与电磁干扰。
- 良好的浪涌承受能力：30A 单次浪涌能力适用于瞬态电流场景。
- 宽工作温度范围与稳健封装：适合工业级与商用环境应用。
四、典型应用场景
- 开关电源输出整流/续流二极管
- 逆向保护与反接保护电路（如电池保护）
- DC-DC 转换器与电源管理模块
- 汽车电子低压回路、通用直流母线整流（在耐压与温度范围允许的情况下）
五、封装与设计注意事项
- SMAF 表面贴装封装，适合自动化贴装与回流焊；在 PCB 布局时应考虑热流散路径，增大铜箔面积以帮助散热。
- 反向泄漏随温度上升而增大，长期高温工作时应预留足够的散热余量并评估漏电带来的静态功耗。
- 若电路存在较大峰值或频繁浪涌，应验证器件在具体波形下的热应力与寿命。
- 推荐在规范的回流焊温度曲线下焊接，并按晶导微电子提供的封装尺寸与焊盘建议设计 PCB。
六、可靠性与采购信息
SS16F 由晶导微电子生产，适配工业与商用批量生产需求。选型时请参考官方数据手册，若应用涉及极端浪涌、高温或汽车级认证需求，建议与供应商确认器件的样片测试与长期可靠性数据。总体而言，SS16F 在中小功率整流与保护场景中具有成本效益和性能平衡的优势。
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