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Jingdao Microelectronics SS36F
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic SS36F
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- SS36F
- Electronic Component
- 1
- Package
- SMAF
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.056g
- Electronic Component
- 1
- Electronic Component
- BM0229356802
- Current
- 3A
- Diode
- 1
- Current(Ir)
- 500uA@60V
- (Vf)
- 700mV@3A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS36F 肖特基二极管 产品概述
一、概述
SS36F 为晶导微电子推出的一款功率肖特基整流二极管，采用 SMAF 表面贴装封装，适用于中大电流整流与保护场合。器件设计侧重低正向压降与快速响应，适合开关电源、DC-DC 转换、整流桥及反向保护等应用。
二、主要性能参数
- 直流正向电流（整流电流）：3A（持续）
- 正向压降（Vf）：典型值 700mV @ 3A
- 直流反向耐压（Vr）：60V
- 反向电流（Ir）：500µA @ 60V（Ta或Tj需参照器件数据表）
- 非重复峰值浪涌电流（Ifsm）：80A（单次浪涌）
- 工作结温范围：-55℃ ~ +125℃
- 封装：SMAF（表贴）
三、产品特性与优势
- 低正向压降：700mV@3A 降低导通功耗，有利于提高效率并减小发热。
- 快速恢复：肖特基特性带来极短的反向恢复时间，适合高频开关场合。
- 良好浪涌能力：80A 单次峰值浪涌可承受开机或短时过载情况。
- 紧凑封装：SMAF 有利于高密度 PCB 布局与自动化贴装。
四、适用场景
- 开关电源次级整流、输入整流
- DC-DC 转换器与降压模块的续流/整流
- 反向极性保护、电池管理与电源切换
- LED 驱动、功率模块中的稳压与保护电路
五、封装与热管理建议
- 持续 3A 工作时器件功耗约 P ≈ Vf×I ≈ 2.1W，需配合合理铜箔散热：加大焊盘面积、连通沉铜与底层热 vias。
- 参考器件热阻参数进行结温计算，保证在最大环境温度下结温不超过额定值并留有裕量。
- 推荐按照厂商回流焊曲线进行焊接，避免超温或长时间回流。
六、可靠性与选型提示
- 反向漏电在高耐压条件下为 500µA，若系统对漏电敏感（如高阻检测、计量类）应优先考虑低漏型器件。
- 若用于汽车或高可靠性场合，请确认是否具备相关认证（如 AEC-Q）。
- 浪涌能力为非重复峰值，若有频繁冲击或长时大电流冲击，应评估能量吸收与器件寿命。
七、包装与订购
- 品牌：晶导微电子；封装：SMAF。
- 订购时请注明型号 SS36F 与所需包装形式（卷带、盘装等），并向供应商索取最新数据手册与回流焊工艺建议，以便校核电气与热性能。
如需器件的完整温度特性曲线、热阻参数或典型应用电路，可提供数据手册与参考电路图以便进一步设计校核。
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