WMSIC Electronic Components

Jingdao Microelectronics S3MF

ModelS3MF
PackageSMAF
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic S3MF
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
S3MF
Electronic Component
1
Package
SMAF
Electronic Component
General Purpose Diode
Electronic Component
0.056g
Electronic Component
1
Electronic Component
BM0226519839
Current
3A
Diode
Electronic Component
Current(Ir)
5uA@1000V
(Vf)
1.1V@3A
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
1kV

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S3MF 产品概述

一、概述

S3MF 是晶导微电子推出的通用独立式整流二极管,采用 SMAF 封装,面向中高压整流与保护应用。器件在 3A 直流整流条件下正向压降典型值 1.1V,直流反向耐压高达 1000V,反向漏电流在 1000V 条件下仅 5µA,兼顾高耐压与低漏电的要求,适合工业电源、开关电源及高压整流场合使用。

二、主要参数(概要)

  • 器件型号:S3MF
  • 品牌:晶导微电子
  • 封装:SMAF(独立式)
  • 直流整流电流(Io):3A
  • 正向压降(Vf):1.1V @ 3A(典型)
  • 反向直流电压(Vr):1000V
  • 反向电流(Ir):5µA @ 1000V
  • 非重复峰值浪涌电流(Ifsm):80A(一次性浪涌能力,受脉冲宽度与温度影响)

三、产品特点

  • 高耐压:1000V 额定反向电压,适用于高压整流与续流保护。
  • 低漏电:在高压下反向电流控制良好,有利于降低待机损耗与自放电。
  • 中等正向压降:1.1V @ 3A,兼顾损耗与热管理。
  • 良好浪涌能力:80A 非重复峰值浪涌电流,能抵御启动或故障时的短时冲击电流。
  • 标准封装:SMAF 便于自动贴装和波峰/回流焊接,利于批量生产。

四、典型应用场景

  • 开关电源(SMPS)高压整流与续流二极管
  • 功率因数校正(PFC)输入整流级(与系统要求匹配时)
  • 高频变换器与电机驱动的保护二极管
  • 工业电源、照明驱动以及高压电源模块中的整流与保护
  • 充电设备与电池管理系统的高压整流场合(视具体电路要求)

五、设计与热管理建议

  • 散热:3A 持续整流会产生显著热量,建议在 PCB 上为二极管留足铜箔散热面积(尤其为焊盘背面和大面铜平层),必要时与散热片配合使用。
  • 浪涌保护:Ifsm 为非重复峰值能力,设计时仍应避免频繁大幅度浪涌,必要时并联浪涌抑制器或使用更高规格器件。
  • 温度与降额:工作环境温度升高会增大 Vf 与 Ir,应按照系统可靠性要求进行热仿真与降额设计。
  • 焊接工艺:遵循封装对应的回流焊曲线与焊接规范,避免过热导致封装或内部结构损伤。

六、封装与采购信息

  • 封装形式:SMAF,独立式器件,适合自动化装配。
  • 标识与订购:产品标称为 S3MF,品牌为“晶导微电子”。采购时请核对完整规格书以确认 Ifsm 波形、测试条件及推荐 PCB 尺寸。
  • 可靠性与测试:建议向供应商索取详细数据手册(含热阻、极限值、浪涌测试条件及典型特性曲线)以便在产品开发中做精确选型。

结论:S3MF 是一款面向中高压整流和保护的通用二极管,凭借 1000V 的耐压与 3A 的整流能力,适合多种工业与电源应用。为保证长期可靠性,请在系统设计中重视散热、浪涌保护与工作温度降额,并参考完整数据手册完成最终选型与布局。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.