WMSIC Electronic Components

Jingdao Microelectronics RS2M

ModelRS2M
PackageSMA
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic RS2M
Type
Jingdao Microelectronics
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
RS2M
Electronic Component
1
Package
SMA
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.12g
Electronic Component
1
Electronic Component
BM0229356820
Current
2A
Diode
1
Current(Ir)
5uA@1kV
(Vf)
1.3V@2A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RS2M 产品概述

一、产品简介

RS2M 是晶导微电子推出的一款独立式快恢复/高效率整流二极管,SMA 封装设计,定位于高电压中等电流的电源整流与回路钳位场景。器件兼顾高耐压与较低的反向漏电,适用于开关电源、逆变器与工业高压电源中的中高频整流与稳压保护。

二、主要技术参数

  • 二极管配置:独立式(单只)
  • 正向压降(Vf):1.3V @ IF = 2A
  • 直流反向耐压(Vr):1000V(1kV)
  • 额定整流电流(IF):2A(连续)
  • 反向电流(IR):5µA @ VR = 1kV
  • 反向恢复时间(Trr):500ns(典型)
  • 工作结温范围(Tj):-55℃ ~ +150℃
  • 非重复峰值浪涌电流(Ifsm):50A(单次脉冲)
  • 封装:SMA(表面贴装)

三、主要特性与优势

  • 高耐压:1kV 反向耐压使其可直接应用于高压开关电源与工业供电系统中,减少级联或并联器件数量。
  • 低泄漏:在满压条件下反向漏电仅为 µA 级,利于高压侧能耗与静态漏电控制。
  • 快恢复性能:500ns 的反向恢复时间在中高频开关应用中能有效降低开关损耗与振铃,相比普通慢恢复二极管具有更好效率表现。
  • 中等正向压降:1.3V @2A 在高压整流场合属于可接受范围,在设计时可通过并联或增加散热降低结温以控制功耗。
  • 抗浪涌能力强:单次 Ifsm 50A,可应对短时启动突发电流或浪涌冲击。

四、典型应用场景

  • 高压开关电源(HV SMPS)二次整流或初级钳位。
  • 升压/降压变换器中的自由轮二极管(freewheeling)。
  • 工业电源、模块化电源、医疗/测试设备的高压整流。
  • 逆变器与电机驱动中的反向吸收/钳位保护电路。

五、安装与散热注意事项

  • SMA 为小型表贴封装,推荐短走线、增大铜箔散热面积并在焊盘下方或附近布置过孔以导热至多层地/散热层。
  • 结温升高会显著增加正向压降与反向泄漏,设计中应考虑器件结温与功耗(Pd ≈ Vf × IF),在高电流或高环境温度下使用适当的散热措施或并联使用。
  • 避免长期在 Ifsm 电平下工作,浪涌仅作短时保护;频繁浪涌需选用更高 Ifsm 规格或采用浪涌抑制电路。

六、可靠性与测试建议

  • 建议在实际应用中进行热阻测量与结温计算,验证在最大工作电流与工作频率下的安全裕度。
  • 对于关键应用,开展高温工作寿命(HTOL)与重复浪涌测试,以确认长期可靠性。
  • 在 PCB 设计阶段进行电磁兼容(EMC)与开关瞬态测试,评估反向恢复引起的尖峰与干扰,并在必要处增加 RC/TVS 抑制。

七、选型建议

若目标电路工作电压接近或超过数百伏且需兼顾开关效率与低漏电,RS2M 是一个平衡耐压、恢复速度与成本的选择。若需更低正向压降且工作电压较低,可考虑肖特基器件;若工作频率更高或要求更快恢复,应选用 Trr 更短的快速恢复或超快恢复二极管。选型时请结合实际结温、开关频率和浪涌条件综合评估。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.