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Jingdao Microelectronics 1SMAF4734A
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic 1SMAF4734A
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- 1SMAF4734A
- Electronic Component
- 1
- Package
- SMAF
- Electronic Component
- Zener Diode
- Electronic Component
- 0.056g
- Electronic Component
- 1
- (Zzt)
- 5Ω
- Electronic Component
- BM0227663768
- Diode
- 1
- Current(Ir)
- 10uA@2V
- Power Dissipation(Pd)
- 1W
- Electronic Component
- 5.32V~5.92V
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SMAF4734A 产品概述
一、产品简介
1SMAF4734A 是晶导微电子推出的一款独立式稳压二极管（齐纳/稳压管），额定稳压值为 5.6V。该器件采用 SMAF 封装，体积小、可靠性高，适合在各种受限空间的电源稳压与过压保护场合中使用。器件设计用于低功耗稳压及瞬态吸收、参考电压源等应用，具有良好的温度范围和抗浪涌能力。
二、主要电气与热参数
- 稳压值（标称）：5.6V
- 稳压值（范围）：5.32V ~ 5.92V
- 反向电流 Ir：10µA @ 2V
- 耗散功率 Pd：1W（在规定的散热条件下）
- 动态阻抗 Zzt：5Ω
- 工作结温范围：-55℃ ~ +150℃
- 封装类型：SMAF
- 品牌：晶导微电子
三、特性与优势
- 标称 5.6V 输出，灵敏稳压，适用于低电流稳压场合；
- 低反向漏电流，适合对静态功耗敏感的电路；
- 动态阻抗较低（5Ω）有利于减小输出纹波与波动；
- 宽温度范围，适应严苛环境工作要求；
- SMAF 小型封装，便于表面贴装与自动化生产。
四、典型应用场景
- 小功率基准电源或参考电压源；
- 微控制器、模拟前端的局部稳压与保护；
- 信号链路和传感器电路的过压保护；
- 功率受限的便携设备、电池管理辅助稳压；
- 抗浪涌/瞬态钳位电路。
五、电路及使用注意事项
- 常见接法：稳压二极管通常并联在负载两端，外接串联限流电阻以限制通过二极管的电流；
- 限流计算示例：R = (Vin_max - Vz) / Iz，其中 Iz 为设计通过稳压二极管的工作电流；为保证器件不超温运行，应将 Iz 控制在允许的功耗范围内（Pd = Vz × Iz ≤ 额定耗散功率，留有裕度）；
- 由于 Pd 为 1W，实际应用中需考虑 PCB 散热、铜箔面积及通孔散热，以免结温超限；
- 在低电压差或弱散热条件下，务必检查结温并考虑热降额。
六、封装与焊接建议
- SMAF 为常见的表贴封装，应采用推荐的 PCB 焊盘与回流焊工艺；
- 建议在焊接时遵循封装厂商的回流曲线，避免超过器件最高结温；
- 若需更好散热，可在焊盘周边增加铜箔面积或加装导热过孔。
七、可靠性与测试
- 器件适用工作结温范围宽，可通过温度循环、稳态老化和浪涌试验验证长期可靠性；
- 使用前建议查看完整规格书以获取详尽的电压-电流曲线、稳压特性曲线与热阻数据，按实际应用做边界条件验证。
八、订购与替代
- 型号：1SMAF4734A；品牌：晶导微电子；封装：SMAF。
- 采购时请确认批次标识与规格书一致，如需更高耗散或不同封装，可向供应商咨询替代型号或更高功率等级的稳压二极管。
备注：以上为基于器件关键参数的概述性说明，实际设计与应用请以厂商最新规格书和应用指南为准。
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