Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Jingdao Microelectronics SS22
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic SS22
- Type
- Jingdao Microelectronics
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- SS22
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.12g
- Electronic Component
- 1
- Electronic Component
- BM0227664051
- Current
- 2A
- Diode
- 1
- Current(Ir)
- 500uA@20V
- (Vf)
- 550mV@2A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS22 肖特基二极管（晶导微电子）产品概述
一、主要性能与规格
SS22 为晶导微电子推出的一款单个独立式肖特基整流二极管，采用 SMA 封装，适合中等功率整流与保护应用。核心参数如下：
- 正向压降 Vf：0.55 V @ 2 A
- 额定整流电流：2 A（直流）
- 非重复峰值浪涌电流 Ifsm：50 A（单次脉冲）
- 直流反向耐压 Vr：20 V
- 反向电流 Ir：500 μA @ 20 V（标称测试点）
- 工作结温范围：-55 ℃ 至 +125 ℃
二、关键特性解析
- 低正向压降：0.55 V@2 A 的典型值使得 SS22 在高电流下具有较低的导通损耗，提高整流效率并降低发热，适合对效率敏感的电源线路。
- 快速恢复与肖特基特性：作为肖特基器件，开关恢复时间极短，适合开关电源、升降压转换器和快速脉冲场合。
- 抗浪涌能力：50 A 的非重复峰值浪涌电流，允许器件承受开机或瞬态电流冲击，但不建议作为常态承载手段。
- 反向泄露：在 20 V 时 Ir=500 μA，随温度升高会明显增加，设计时应考虑温度对泄漏与功耗的影响。
三、典型应用场景
- 开关电源次级整流
- DC-DC 转换器与同步整流替代
- 反向极性和反冲保护
- 电池充放电路径保护与整流
- 电机驱动、继电器钳位与快速钳位电路
四、热管理与电气设计注意事项
在 2 A 工作点，器件正向损耗约为 P = Vf × I ≈ 1.1 W，此热量需通过 SMA 封装及 PCB 铜箔散出以保证结温在允许范围内。建议：
- 在封装两侧增加散热铜箔与过孔，扩大热回流路径；
- 对长期高电流工况进行适当电流降额或使用并联方案（需注意电流分享问题）；
- 在高温环境下考虑反向漏电增加对系统待机功耗的影响并适当降额。
五、封装与焊接建议
SS22 为 SMA 表面贴装封装，器件极性通常由封装条纹标示。焊接建议遵循通用 SMA 器件工艺与 IPC/JEDEC 推荐的回流曲线及预热/冷却控制，避免长时间过高温度暴露以保护结温及封装可靠性。
六、可靠性与测试建议
- 在设计验证阶段应进行热仿真与实际热测，确认结温在最大允许值内；
- 对浪涌与反复脉冲场景做单脉冲与重复脉冲测试，验证 Ifsm 与长期应力下的可靠性；
- 对高温工作点测量反向漏电随温度变化曲线，以评估待机与泄漏功耗。
七、采购与型号标识
型号：SS22；品牌：晶导微电子；封装：SMA；常用于工业类、消费类电源模块与保护电路。采购时请确认批次与实际出厂测试条件（如 Ir 的测试温度），并索取器件完整数据表以获得详细的热阻、最大结温和焊接曲线等信息。
总结：SS22 以其低正向压降、较高浪涌承受能力与 SMA 封装的通用性，适合多种中功率整流与保护应用。设计时应重视热管理与温升对漏电与寿命的影响，必要时通过 PCB 散热优化或器件并联来满足更高电流需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
