WMSIC Electronic Components

Jingdao Microelectronics MM1Z15W

ModelMM1Z15W
PackageSOD-123W
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic MM1Z15W
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
MM1Z15W
Electronic Component
1
Package
SOD-123W
Electronic Component
Zener Diode
Electronic Component
±5%
Electronic Component
0.018g
Electronic Component
50
(Zzt)
40Ω
Electronic Component
BM0234548048
Diode
1
Current(Ir)
100nA@11V
Power Dissipation(Pd)
500mW
Electronic Component
13.8V~15.6V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MM1Z15W 产品概述

一、产品简介

MM1Z15W 是晶导微电子出品的一款小功率稳压(二极管)器件,标称稳压值为 15V,出厂稳压范围为 13.8V ~ 15.6V,标称精度 ±5%。器件支持宽工作结温 -55℃ 至 +150℃,适合空间受限和低功耗场合的基准与过压保护应用。封装为 SOD-123W,便于表面贴装组装与自动化生产。

二、电气与热特性(关键参数)

  • 标称稳压值(Vz):15V(出厂检验范围 13.8V~15.6V,精度 ±5%)。
  • 反向电流(Ir):100nA @ 11V,漏电极极低,适合高阻抗电路。
  • 耗散功率(Pd):500mW,为器件在良好散热条件下的最大耗散能力。
  • 动态阻抗(Zzt):40Ω,表示在测试电流下的等效阻尼,影响负载变化时的稳压能力。
  • 最大结温范围:-55℃ ~ +150℃,工作温度对稳压点和功耗有影响,应予以考虑。

基于 Pd 与 Vz 的关系,可估算最大稳压电流 Iz_max ≈ Pd / Vz = 0.5W / 15V ≈ 33mA。该值为在稳压区允许的最大电流上限,实际设计时应留有裕量以保证长期可靠性。

三、设计与选型要点

  1. 功率限流:为了避免过载并延长寿命,应保证稳压电流远低于 Iz_max。设计中常按安全裕量选择工作电流(例如 ≤ Iz_max 的 50%~80%),并通过串联限流电阻来控制电流。
    示例:电源 24V 时,为使 Iz 不超过 33mA,串联电阻 R ≥ (24V - 15V) / 33mA ≈ 270Ω;为增设裕量可取更大阻值。
  2. 动态阻抗影响:Zzt = 40Ω 表明在负载或输入波动时会产生明显的压降。若要求更稳定的输出或更低纹波,应增大稳流电流(在安全功率下)或并联低阻抗的串联稳压方案。
  3. 漏电与高阻设计:Ir 极低(100nA@11V),适合作为参考源或用于测量电路,但在极低电流场合需注意泄漏对测量精度的影响。
  4. 温度漂移考虑:结温升高会影响稳压点和耗散能力,设计 PCB 时应考虑良好散热、短走线并避免热源贴近。

四、典型应用场景

  • 低功耗直流稳压与基准源(小电流场合)。
  • 被动式电压钳位、浪涌钳位与过压保护。
  • 分立式电源模块、传感器和便携设备中的局部稳压。
  • 模拟与混合信号电路中的参考电压源(要求低漏电的场合)。

五、封装与工艺注意事项

SOD-123W 为小型表贴封装,利于高密度布板和自动贴装。焊接建议遵循厂商的回流曲线,避免过高的峰值温度或长时间高温暴露以保护内部结构。焊盘设计应保证良好散热通道,必要时在焊盘下方或附近布置铜箔/过孔以利热量扩散。

六、可靠性与测试建议

  • 在实际应用中建议对代表性样片进行温度循环、长时间功耗验证以及实际电源波动下的稳压特性测试。
  • 对于需要长期稳定参考的设计,应进行老化或筛选以确认稳压点和漏电在允许范围内。
  • 在 PCB 布局上保持稳压二极管与被保护节点走线最短,旁路电容(如需要)应靠近器件引脚放置以改善瞬态响应。

结语:MM1Z15W 以其 15V 的标称稳压、低漏电和小型封装,适用于各类低功耗稳压与保护应用。选型时应重点关注功率限流、稳压电流设计及散热条件,以确保长期稳定可靠运行。

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