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Jingdao Microelectronics MB14S
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic MB14S
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- MB14S
- Electronic Component
- 1
- Package
- MBS
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.211g
- Electronic Component
- 1
- Electronic Component
- BM0229356814
- Current
- 1A
- Current(Ir)
- 300uA@40V
- (Vf)
- 550mV@1A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MB14S 产品概述
一、产品简介
MB14S 是晶导微电子推出的一款单相整流桥，针对小功率整流与通用电源转换场合设计。器件采用 MBS 封装，结构紧凑、可靠性高，适用于交流转直流、极性保护及低功耗整流场合。
二、主要参数
- 类型：单相整流桥
- 正向压降 (Vf)：550 mV @ 1 A（单只二极管）
- 直流反向耐压 (Vr)：40 V
- 整流电流：1 A（连续）
- 反向电流 (Ir)：300 μA @ 40 V
- 非重复峰值浪涌电流 (Ifsm)：40 A
- 工作结温范围：-55 ℃ ~ +125 ℃
- 品牌：晶导微电子
- 封装：MBS
说明：整流桥每次导通路径包含两只二极管，桥式整流的总压降约为 2×Vf ≈ 1.1 V @ 1 A，设计时应计入此压降和相应的功耗。
三、产品特性
- 低正向压降：单只二极管 Vf=0.55 V@1 A，有利于降低整流损耗，提升效率。
- 良好的浪涌能力：Ifsm=40 A，可承受瞬态冲击电流，适合有启动浪涌的应用。
- 宽温度范围：工作结温覆盖 -55~+125 ℃，适应工业级环境。
- 可靠的反向耐压与漏电流特性：Vr=40 V、Ir=300 μA@40 V，适用于低压直流输出场景。
四、典型应用
- 小型开关电源二次侧整流
- 家用电器和适配器的桥式整流
- 电池充电与电源管理模块
- 极性保护与反接保护电路
- 通信和仪器仪表低功率电源
五、安装与使用建议
- 温升控制：连续 1 A 工作时需注意结温上升，建议在 PCB 上配置适当铜箔面积或热传导路径，必要时考虑散热片。
- 浪涌保护：尽管 Ifsm 能承受短时浪涌，仍建议在入线处使用慢熔断器或热敏元件保护电路免受反复浪涌损伤。
- 滤波与旁路：整流后并联足够的滤波电容以降低纹波，同时在高频环境下加入旁路电容抑制射频干扰。
- 焊接工艺：遵循 MBS 封装的回流温度曲线，避免过高温度与长时间加热导致器件性能退化。
六、常见注意事项与选型提示
- 在选择该器件时，若系统工作电压接近或超过 40 V，应提升耐压等级或并联/采用更高 Vr 的型号。
- 若持续电流或散热条件不理想，可考虑更高电流/低压降的桥堆或外置散热方案。
- 对于对漏电流敏感的应用（如低功耗待机），需留意 Ir=300 μA 的影响并评估对待机功耗的贡献。
七、封装与库存信息
MB14S 采用 MBS 小型封装，便于表面贴装或通孔布局集成。具体引脚排列、封装尺寸与回流工艺请参考晶导微电子提供的封装图与 PCB 布局建议，以保证可靠焊接与热散。
总结：MB14S 以其低正向压降、良好浪涌能力和宽温度适应性，适合用于各类小功率整流场景。设计时需综合考虑压降引起的功耗与散热措施，合理保护以延长器件寿命并保证电源稳定运行。
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