WMSIC Electronic Components

Jingdao Microelectronics MM1Z15

ModelMM1Z15
PackageSOD-123
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic MM1Z15
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
MM1Z15
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.036g
Electronic Component
1
(Zzt)
40Ω
Electronic Component
BM0229356717
Diode
1
Current(Ir)
100nA@11V
Power Dissipation(Pd)
500mW
Electronic Component
13.8V~15.6V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MM1Z15 产品概述

一、产品简介

MM1Z15 是晶导微电子推出的一款独立式稳压二极管,标称稳压值为 15V。该器件采用 SOD-123 小封装,适合对体积和成本有要求的板级稳压与过压保护场合。凭借较低的反向漏电和稳定的阻抗特性,适用于精密模拟电路和电源保护电路中的基准或稳压元件。

二、主要参数

  • 稳压值(标称):15V
  • 稳压值范围:13.8V ~ 15.6V
  • 反向电流 Ir:100 nA @ 11V(低漏电,利于高阻抗电路)
  • 动态阻抗 Zzt:40 Ω(在规定测试电流下的阻抗)
  • 功耗 Pd:500 mW(最大耗散功率)
  • 配置:独立式稳压二极管(不是阵列或基准)
  • 封装:SOD-123
  • 品牌:晶导微电子

三、性能特点

  • 低漏电:在 11V 时反向电流仅 100 nA,可用于高输入阻抗或低偏流的应用场景,减少对后端电路的影响。
  • 良好稳压能力:典型稳压值接近 15V,动态阻抗 40 Ω,能在小电流范围内提供稳定的参考电压。
  • 紧凑封装:SOD-123 体积小,便于表面贴装和批量生产,适合空间受限的电路板布局。
  • 中等功耗能力:最大耗散功率 500 mW,适合低至中等电流的分流稳压应用;需注意功率热管理。

四、典型应用

  • 板级基准或低成本稳压源(小电流场合)
  • 电源过压保护与钳位电路
  • 模拟电路的参考电压与偏置源
  • 便携式设备和通信设备中的电压屏蔽与保护

五、使用建议与注意事项

  • 工作方式:作为稳压二极管使用时需反向偏置。正确定义系列限流电阻 R,可用公式 R = (Vin - Vz) / Iz,其中 Iz 为通过稳压管的电流。
  • 功率计算:稳压二极管功耗 Pd = Vz × Iz,请确保 Pd 不超过器件最大额定值,并预留一定的裕量以提高可靠性(建议在实际应用中考虑降额使用)。
  • 热管理:SOD-123 为小封装,散热能力有限。在高环境温度或较大稳压电流下,应评估结温并进行必要的降额或热路径优化。
  • 电路布局:靠近受保护元件放置能缩短回路长度,减小寄生电感与电阻。焊接时遵循制造商的回流焊工艺规程,避免过热。
  • ESD 与可靠性:在装配与测试过程中采取防静电措施,避免静电损伤。

六、封装与采购信息

MM1Z15 封装为 SOD-123,适合自动贴片生产。订购时请以晶导微电子的产品型号与规格书为准,若用于关键/量产项目,建议索取样品并进行环境与寿命评估测试,确认在目标工况下的温升与长期可靠性满足要求。

如需进一步的电气特性曲线(如伏安特性、动态阻抗随电流变化曲线)、温度特性或封装尺寸图与焊接工艺建议,可提供具体需求,以便获取详细数据表与应用参考。

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