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Jingdao Microelectronics MBR1040DT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic MBR1040DT
- Type
- Jingdao Microelectronics
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- MBR1040DT
- Electronic Component
- 1
- Package
- TO-252-2
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.464g
- Electronic Component
- 1
- Electronic Component
- BM0258654418
- Current
- 10A
- Diode
- 1
- Current(Ir)
- 100uA@40V
- (Vf)
- 700mV@5A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MBR1040DT 产品概述
一、产品简介
MBR1040DT 是晶导微电子推出的一款功率肖特基整流二极管，双芯片封装为一对共阴极（common cathode），适用于中高电流、低压降的整流与保护场合。器件在 5A 工作点的正向压降仅约 700mV，具有快速恢复、低正向压降和较小反向漏电的特点，适合开关电源、整流桥、续流二极管与反向保护等应用。
二、主要电气特性
- 正向压降 (Vf)：约 0.7V @ IF=5A（单芯片测）；低压降可减少导通损耗。
- 直流反向耐压 (Vr)：40V，适用于低压电源与电池系统。
- 连续整流电流：10A（良好散热条件下），适合中大电流整流应用。
- 峰值非重复浪涌电流 (Ifsm)：100A（单次峰值），满足启动或短时冲击电流需求。
- 反向漏电流 (Ir)：100μA @ 40V（典型或上限值），在高温下会增大；适用于对漏电要求不是极端苛刻的场合。
- 工作结温范围：-55℃ ~ +150℃，适应工业级温度要求。
三、封装与机械特点
- 封装形式：TO-252-2（DPAK 类），表面贴装，便于自动化装配。
- 热性能：TO-252-2 通过底部散热焊盘与 PCB 散热，实际散热能力依赖于焊盘面积与过孔数；充分铺铜并引入热过孔能显著降低结温。
- 引脚配置：一对共阴极，便于构建半桥或整流桥电路，减小系统占板面积。
四、典型应用场景
- 开关电源输出整流与续流二极管。
- 充电器与电池管理系统的低压整流与反向保护。
- 汽车电子（低压子系统）、工业电源与电机驱动的自由轮整流。
- 高频整流与功率模块中替代普通快恢复二极管以降低功耗。
五、使用与布局建议
- 散热设计：在接近最大整流电流工作时，需在 PCB 上配备充足的散热铜箔及多孔过孔，将热流引导至散热层或散热片。
- 布线要求：正负极短且粗，减小串联电阻与电感；靠近负载或电源端放置以减少回路面积。
- 温度影响：反向漏电随温度上升显著增加，长时间高温工作需考虑电流与功耗的降额。
- 浪涌保护：Ifsm 为非重复峰值，若存在频繁冲击或反复浪涌，应增加软起动电路或选择更高浪涌能力器件。
- 并联注意：若通过并联提高电流能力，应确保电流分享机制（如匹配 Vf 或串接限流）以防单颗过载。
六、可靠性与选型提示
MBR1040DT 在工业温度范围内可长期稳定工作，但在具体设计中需关注散热、反向漏电与浪涌能力。对于对正向压降要求更低或反向耐压更高的特殊场合，可比较同类不同 Vf/Vr 等级的肖特基器件以优化效率与可靠性。晶导微电子的该型号在中低压高电流整流领域性价比高，适合量产与工业级产品应用。
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