WMSIC Electronic Components

Jingdao Microelectronics US2GB

ModelUS2GB
PackageSMB
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic US2GB
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
US2GB
Electronic Component
1
Package
SMB
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.167g
Electronic Component
1
Electronic Component
BM0227518123
Current
2A
Diode
1
Current(Ir)
5uA@400V
(Vf)
1.3V@2A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

晶导微电子 快恢复/高效率二极管(独立式 SMB)产品概述

一、产品简介

晶导微电子推出的独立式快恢复高效率二极管,封装为SMB,面向开关电源、功率变换及整流应用。器件在2A工作电流下正向压降仅为1.3V,反向耐压高达400V,反向电流小于5μA(400V时),且反向恢复时间仅50ns,综合了低导通损耗与快速开关性能,适合对效率与开关性能有较高要求的电力电子系统。

二、主要参数

  • 二极管类型:独立式(单个芯片封装)
  • 封装:SMB
  • 正向压降(Vf):1.3V @ IF = 2A
  • 直流反向耐压(Vr):400V
  • 反向电流(Ir):5μA @ Vr = 400V
  • 反向恢复时间(Trr):50ns
  • 连续整流电流:2A
  • 工作结温范围(Tj):-55℃ ~ +150℃

三、产品特点

  • 低正向压降:减少导通损耗,提高转换效率,降低器件发热。
  • 快速恢复特性:50ns的Trr显著降低开关损耗和过渡电压,应对高速开关环境效果优异。
  • 低反向泄漏:在高压条件下保持微安级漏流,有利于提升高压侧稳定性与低损耗运行。
  • SMB封装:兼顾散热与抗机械应力,便于波峰/回流焊与手工焊接。

四、典型应用场景

  • 开关电源(SMPS)整流与自由轮二极管
  • PFC(功率因数校正)电路整流
  • 充电器与适配器输出整流
  • 逆变器与电机驱动的续流/吸收回路
  • 工业电源与通信电源的保护与整流模块

五、使用与设计建议

  • 散热:SMB封装通过PCB铜箔扩散热量,建议在焊盘处加大铜箔面积并增加过孔以降低结温;在高平均电流或高工作温度场合按热阻进行适当降额。
  • 布局:开关节点与二极管的走线应尽量缩短并增宽,减少回路电感以降低电压尖峰与振铃;靠近功率器件布局以优化热管理。
  • 保护与可靠性:高速开关应用中建议配合适当的RC缓冲或TVS抑制尖峰,避免超出器件瞬态耐压;高温下长期运行应采用电流/功率降额设计。
  • 驱动与频率:在高开关频率条件下,快恢复性能有利于减少损耗,但仍需注意反向恢复产生的电流尖峰对周边器件的冲击。

六、可靠性与测试

产品通过常规的温度循环、稳态功耗测试和冲击耐压试验;典型出厂检验包括正向压降、反向耐压、反向电流与反向恢复时间等关键参数检测,满足工业级应用的长期稳定性要求。

七、封装与采购信息

  • 封装形式:SMB(表面贴装或插件兼容)
  • 品牌:晶导微电子
  • 订购注意:请在采购前确认工作电流与散热方案、以及是否需包装(卷带/托盘)与不同等级的放电/浪涌能力选项。

如需完整规格书、波形图或典型电路应用图,请与晶导微电子销售或技术支持联系获取详细资料。

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