WMSIC Electronic Components

Jingdao Microelectronics MM3Z5V1

ModelMM3Z5V1
PackageSOD-323
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic MM3Z5V1
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
MM3Z5V1
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.028g
Electronic Component
1
(Zzt)
130Ω
Electronic Component
BM0229356819
Diode
1
Power Dissipation(Pd)
200mW
Electronic Component
4.8V~5.4V
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MM3Z5V1 产品概述

一. 产品简介

MM3Z5V1 是晶导微电子推出的一款独立式稳压二极管(Zener diode),额定稳压值为 5.1V,适用于小功率电压参考和稳压保护场合。器件采用 SOD-323 小型贴片封装,体积小、易于表面贴装,适合紧凑型电路板设计。

二. 主要规格

  • 稳压值(标称):5.1V
  • 稳压值范围:4.8V ~ 5.4V
  • 反向电流 Ir:2 μA @ 1.5V
  • 耗散功率 Pd:200 mW(最高)
  • 阻抗 Zzt:130 Ω
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SOD-323(独立式)
  • 品牌:晶导微电子

三. 关键特性与优势

  • 小型 SOD-323 封装,节省 PCB 空间,适合移动设备和便携式产品。
  • 低反向漏电(2 μA @ 1.5V),在微小电流场合能保持较低的静态损耗。
  • 稳压范围控制良好(4.8V–5.4V),适合对 5V 近似参考要求的应用。
  • 200 mW 耐耗功率能力满足多数信号和小功率稳压场景。
  • 工作温度范围宽(-55 ℃~+150 ℃),适应工业级环境。

四. 典型应用

  • 低功耗电路的基准电压源与电压箝位。
  • 电源反向/过压保护与瞬态抑制(配合限流电阻)。
  • 模拟电路、传感器供电、微控制器辅助参考电压。
  • 通信设备、便携终端与工业控制模块的小功率稳压场合。

五. 使用与设计注意事项

  • 限流电阻计算:当用作齐纳稳压时,串联电阻 R = (Vin - Vz) / Iz,Iz 为期望的齐纳电流。
  • 功率热限制:最大稳态电流 Imax ≈ Pd / Vz = 0.2 W / 5.1 V ≈ 39 mA。为提高可靠性与降低温升,推荐工作电流显著低于此值,典型建议不超过 10–20 mA,视具体热环境与散热条件而定。
  • 动态阻抗较高(Zzt=130 Ω),在负载电流变化较大时,输出电压会产生较明显的摆动;若需更精确的参考电压,应配合稳压放大电路或选择阻抗更低的型号。
  • 注意极性与焊接温度曲线,避免过量再流峰值导致封装或结温损伤。
  • 长期可靠性受 PCB 铜箔尺寸与周围散热条件影响,应在热仿真或实测基础上调整器件布局。

六. 封装与可靠性

SOD-323 封装适合自动贴装与回流焊工艺。工作结温可达 +150 ℃,符合多数工业级温度要求。建议在设计时考虑热阻与附近热源,适当扩大铜箔或增加散热通孔以控制结温。

七. 采购与技术支持

型号:MM3Z5V1,品牌:晶导微电子,封装:SOD-323。购买前请确认应用场景的最大电流与功耗预算,若需样片、器件参数表(详尽的 IV/VZ 曲线、温度系数、封装引脚图)或可靠性测试数据,可联系晶导微电子销售或技术支持获取完整资料。

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