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Jingdao Microelectronics MM1Z3V3
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic MM1Z3V3
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- MM1Z3V3
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.036g
- Electronic Component
- 1
- (Zzt)
- 130Ω
- Electronic Component
- BM0229356818
- Diode
- 1
- Current(Ir)
- 20uA@1V
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 3.1V~3.5V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MM1Z3V3 产品概述
一、产品简介
MM1Z3V3 是晶导微电子推出的一款独立式硅稳压二极管（齐纳二极管），标称稳压值 3.3V，实际稳压范围为 3.1V～3.5V。该器件采用 SOD-123 表面贴装封装，额定耗散功率 500mW，适用于低功耗、空间受限的电子电路中作为基准稳压与过压钳位元件使用。
二、关键参数说明
- 标称稳压：3.3V（稳压范围 3.1V～3.5V）
- 反向泄漏电流：20μA @ 1V（规格书给定测试条件）
- 最大耗散功率：500mW（在指定环境温度及散热条件下）
- 动态阻抗 Zzt：130Ω（表征在测试电流下的微小电压变化对应的电阻）
- 封装形式：SOD-123（小型表贴，适合自动化贴装）
- 器件类型：独立式稳压二极管（离散元件）
三、主要特性与设计意义
- 小体积、易封装：SOD-123 封装兼顾体积与散热，是消费类、电信和工业电子板上常用的贴片形式。
- 低功耗应用：500mW 的耗散功率适合低至中等功率的稳压与钳位场景；在设计时需关注工作电流与环境温度的热耗散限制。
- 非高精度参考：Zzt 值较高（130Ω）和反向漏流特性表明该器件更适合做过压保护、杂散稳压或功能性基准，而非高精度电压基准场合。
- 适用于并联稳压或钳位电路：在输入电压超过 3.3V 时并联到负载侧以限制电压上升，或作为瞬态钳位元件保护后级电路。
四、典型应用场景
- 电源辅助稳压（低功耗模块或子电源）
- 输入过压保护与浪涌吸收
- 通信设备、消费电子、传感器接口和仪表中的电压钳位
- 作为微控制器外围保护或简单参考电压源（非高精度场合）
五、使用建议与注意事项
- 功率与散热：设计时应计算稳压二极管在工作电流下的功耗 P = Vz × Iz，并保证在最大 500mW 耗散范围内；必要时通过降低工作电流或加大散热面积来控制结温。
- 电阻限流：在并联稳压用法中，务必串联限流电阻 R = (Vin - Vz) / Iz（示例计算请根据实际 Iz 选择），以限制器件电流避免过热。
- 动态阻抗影响精度：由于 Zzt 较大，器件在不同电流下稳压值会有明显变化，不适合做要求毫伏级精度的参考源。
- 焊接工艺：SOD-123 为表贴封装，应遵循厂家推荐的回流曲线，避免过热或冷却过快导致应力破坏。
- 环境与可靠性：实际使用时应参考完整规格书中的温度系数、最大反向电压和频繁热循环下的可靠性指标。
六、选型与采购提示
选择 MM1Z3V3 时，请确认目标电路对稳压精度、允许泄漏电流和最大耗散功率的实际需求；若需更高精度或更大功率的稳压，请考虑低 Zzt 或更高 Pd 的替代型号。采购时建议向晶导微电子索取最新版规格书和焊接说明，以及样品做实测验证以确保满足具体设计要求。
如需我帮助进行工作电流、串联电阻或热耗散计算，可提供输入电压、负载电流和工作环境温度，我将为您给出具体设计建议。
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