Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C3V9S是晶导微电子推出的小功率表面贴装稳压二极管,采用独立式单管设计,聚焦低压稳压、低功耗与高密度PCB适配,广泛应用于消费电子、通信及工业控制等对体积和稳定性要求较高的场景。
该器件属于稳压二极管家族中的低压系列,核心围绕“小体积、低功耗、宽温适配”三大设计方向:
稳压值特性
标称稳压值3.9V,实际工作范围3.7V~4.1V(一致性±5%),满足多数低压电路的参考电压或稳压需求(如逻辑电路、传感器偏置电压)。
反向漏电流(Ir)
反向电压1V时漏电流仅3uA,远低于常规稳压二极管(一般几十uA),可有效降低电路待机功耗,延长电池供电设备续航。
耗散功率(Pd)
最大耗散功率200mW,匹配封装散热能力,适合小电流稳压场景(典型工作电流<50mA),避免功率过载失效。
动态阻抗(Zzt)
稳压状态下动态阻抗90Ω,负载电流变化时输出电压波动极小,保障电路稳定性(如通信设备信号调理模块)。
工作结温范围
支持-55℃~+150℃宽温工作,覆盖工业级环境要求,可应用于户外设备、高温工业控制模块。
SOD-323封装具备以下优势:
BZT52C3V9S凭借紧凑体积、低功耗与宽温特性,成为低压稳压场景的高性价比选择,适配多数小型化电子设备需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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