WMSIC Electronic Components

Jingdao Microelectronics SMF54A

ModelSMF54A
PackageSOD-123W
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic SMF54A
Type
Jingdao Microelectronics
Minimum package
3000

Technical parameters

Electronic Component
Electronic
Electronic Component
SMF54A
Electronic Component
1
Package
SOD-123W
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.03g
Electronic Component
1
Channel Count
Electronic Component
Electronic Component
BM0265368838
Voltage
87.1V
Current(Ir)
1uA
Voltage(VBR)
66.3V
Electronic Component
3000
Power(Ppp)
200W@10/1000us
Current(Ipp)
2.3A@10/1000us

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF54A TVS二极管产品概述

一、产品基本定位与品牌背景

SMF54A是晶导微电子推出的单向瞬态抑制二极管(TVS),核心作用是吸收电路中的瞬态浪涌电压,保护敏感电子元器件免受雷击、静电放电(ESD)、开关瞬态等干扰损坏。该产品采用SOD-123W小型化表面贴装封装,适配高密度PCB设计,是消费电子、通信设备等领域的通用防护器件,凭借稳定的电性能与紧凑尺寸,在中低压电路防护场景中应用广泛。

二、核心电性能参数详解

SMF54A的关键参数经过严格测试,指标明确,可精准匹配多数低压电路的防护需求:

  1. 反向截止电压(Vrwm):54V
    电路正常工作时,TVS反向偏置不导通的最大电压,需确保电路正常电压低于此值,避免误触发。
  2. 击穿电压(Vbr):66.3V
    反向电压超过该值时,TVS快速导通进入钳位状态,是过压保护的触发阈值。
  3. 钳位电压(Vc):87.1V
    导通后将电路电压钳位在该值附近,限制浪涌对后级元件的冲击(脉冲电流增大时略有上升,典型值稳定)。
  4. 峰值脉冲电流(Ipp):2.3A@10/1000μs
    10/1000μs标准浪涌波形(前沿10μs、半值时间1000μs)下的最大允许峰值电流,超过可能损坏器件。
  5. 峰值脉冲功率(Ppp):200W@10/1000μs
    对应脉冲波形的最大功率(=钳位电压×峰值电流),是选型核心指标。
  6. 反向漏电流(Ir):1μA
    正常工作电压下漏电流极小,不干扰电路供电或信号传输,适合低功耗场景。
  7. 通道数:单路
    仅支持单向过压防护,双向防护需选同系列双向型号(如SMF54CA)。

三、封装形式与物理特性

SMF54A采用SOD-123W封装,具有明显的小型化优势:

  • 尺寸紧凑:典型尺寸约1.6mm(长)×0.8mm(宽)×0.6mm(高),大幅节省PCB空间,适配便携式设备;
  • 焊接兼容:支持回流焊、波峰焊等主流工艺,焊接可靠性高;
  • 引脚适配:2引脚结构与SOD-123系列其他封装(如SOD-123FL)引脚间距一致,可兼容替换(需核对具体尺寸)。

四、典型应用场景

SMF54A的防护能力与封装特点使其适用于多种低压电路:

  1. 消费电子:手机、平板、笔记本的USB/耳机/充电端口防护,防止静电或充电浪涌损坏芯片;
  2. 通信设备:路由器、交换机的以太网/RS485端口防护,应对线路浪涌干扰;
  3. 工业控制:传感器、PLC的IO端口防护,避免现场电磁干扰或开关瞬态影响;
  4. 低压电源:5V/12V/24V直流电源输出端防护,防止开关瞬态或雷击感应损坏负载;
  5. 车载辅助电子:行车记录仪、车载充电器等通用车载设备的接口防护(非车规级,需确认场景)。

五、产品优势与选型要点

(一)核心优势

  1. 防护可靠:明确的钳位电压与功率指标,精准匹配防护需求,避免过度或不足;
  2. 低干扰:1μA漏电流不影响电路正常工作,适合高精度、低功耗场景;
  3. 小型化适配:SOD-123W封装满足便携式设备的紧凑设计趋势;
  4. 品牌保障:晶导微电子产品一致性好,可靠性经市场验证。

(二)选型注意事项

  1. 电压匹配:电路正常电压需低于54V,避免误导通;
  2. 功率匹配:浪涌功率超200W时,需并联多颗或选更高功率型号;
  3. 方向确认:单向防护仅适用单方向浪涌,双向需换双向TVS;
  4. 封装兼容:若PCB为SOD-123FL,需核对引脚尺寸是否一致。

SMF54A凭借平衡的性能与成本优势,成为中低压电路瞬态防护的常用选择,可有效提升电子设备的抗干扰能力与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.