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Jingdao Microelectronics US8GC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic US8GC
- Type
- Jingdao Microelectronics
- Minimum package
- 3000
Technical parameters
- Electronic Component
- Electronic
- Electronic Component
- US8GC
- Electronic Component
- 1
- Package
- SMC
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.381g
- Electronic Component
- 1
- Electronic Component
- BM0231111030
- Current
- 8A
- Diode
- 1
- Current(Ir)
- 10uA@400V
- (Vf)
- 1.3V@8A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 400V
- (Trr)
- 50ns
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
US8GC 产品概述 — 晶导微电子
US8GC 是晶导微电子面向开关电源和整流应用推出的一款独立式快恢复、高效率二极管。采用SMC封装，针对中高电压、高电流及高速开关场合进行了优化设计，兼顾低导通损耗与快速恢复特性，适合要求高可靠性和低损耗的工业与消费电子设备。
一、主要参数一览
- 二极管配置：独立式（单只器件）
- 正向压降（Vf）：1.3 V @ 8 A
- 直流反向耐压（Vr）：400 V
- 整流电流（IF）：8 A
- 反向电流（Ir）：≤10 μA @ 400 V
- 反向恢复时间（Trr）：50 ns
- 工作结温范围（Tj）：-55 ℃ 至 +150 ℃
- 封装类型：SMC（表面贴装/通孔兼容封装样式）
二、产品特性与优势
- 低正向压降：1.3V@8A 的低Vf 有效降低导通损耗，提升系统效率，尤其在高电流持续整流场合能显著降低发热与能耗。
- 快速恢复：50ns 的短反向恢复时间可减少切换过程中的反向恢复电流和能量损耗，降低电磁干扰（EMI）和开关损耗，适合高频开关电源与功率因数校正电路（PFC）。
- 低漏电流：在400V 反向电压下漏电流仅10 μA，有利于降低空载损耗和提高待机效率。
- 宽温度范围：-55 ℃ 至 +150 ℃ 的工作结温保证在苛刻环境下仍能稳定工作，适用于工业级应用。
- SMC 封装：封装散热面积充足，便于在PCB上与散热系统结合，同时支持自动贴片或波峰/回流焊工艺。
三、典型应用场景
- 开关电源（SMPS）整流与续流回路
- 功率因数校正（PFC）二极管整流器
- 逆变器与电机驱动的续流二极管
- 充电器与适配器的主整流
- UPS、照明电源以及其它要求高效率和快速切换的功率电子设备
四、设计与热管理建议
- 尽量在PCB上为SMC封装提供良好的散热铜箔与过孔连接，以降低结温并提高可靠性。
- 在高频、高电流应用中，请配合适当的缓冲网络（如RC缓冲或斜率控制）以优化开关过渡并减少电压尖峰。
- 考虑设备工作环境与散热条件，确保结温在推荐范围内工作以延长器件寿命。
- 在并联使用多只二极管以提升电流能力时，应保证良好的电流均流设计与对称布局，避免局部过热。
五、可靠性与质量控制
US8GC 采用严格的制造与测试流程，器件在出厂前经过电气参数筛选与温升/热循环评估。建议在关键应用进行必要的可靠性验证（温度循环、焊接热震与长时运行测试），以满足系统级可靠性要求。
六、封装与采购信息
- 品牌：晶导微电子
- 封装：SMC（标准体积，便于自动化贴装与回流/波峰工艺）
- 型号：US8GC（用于订单与技术查阅）
如需更详细的电气参数、典型老化曲线、封装尺寸图或应用电路示例，可向晶导微电子提供的产品手册或技术支持进一步索取。
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