WMSIC Electronic Components

Jingdao Microelectronics RS5GC

ModelRS5GC
PackageSMC
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic RS5GC
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
RS5GC
Electronic Component
1
Package
SMC
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.38g
Electronic Component
1
Electronic Component
BM0264842990
Current
5A
Diode
1
Current(Ir)
5uA@400V
(Vf)
1.3V@5A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RS5GC 产品概述

一、产品概述

RS5GC 是晶导微电子推出的一款高压快速恢复整流二极管,采用低外形 SMC 表面贴装封装,适用于中高压整流与开关保护场合。器件采用玻璃钝化芯片结工艺,具备快速反向恢复特性、低漏电及良好的浪涌承受能力,便于自动化拾取与贴装,适配现代功率电源和电子设备批量生产需求。

二、主要参数

  • 型号:RS5GC(晶导微电子)
  • 封装:SMC(表面贴装,低外形)
  • 直流正向电流(整流电流):5A
  • 正向压降 Vf:1.3V @ 5A
  • 直流反向耐压 Vr:400V
  • 反向电流 Ir:5 µA @ 400V
  • 反向恢复时间 Trr:150 ns(快速恢复)
  • 非重复峰值浪涌电流 Ifsm:120A(单次浪涌承受能力)
  • 工作结温范围:-55 ℃ ~ +150 ℃

三、关键特性

  • 低正向压降低功耗:Vf 约 1.3V(5A),有利于降低整流损耗与发热。
  • 快速反向恢复:Trr 约 150ns,适合开关电源和高频整流场合,减少开关损耗和电磁干扰。
  • 低反向泄漏:Ir 仅 5µA(400V),在高压应用下减小静态功耗。
  • 良好浪涌耐受:Ifsm 可达 120A,能承受启动或瞬态冲击。
  • 可靠的芯片工艺:玻璃钝化处理提高结稳定性和长期可靠性。
  • 适合 SMT 自动化:低外形 SMC 封装,便于拾取与回流焊接。

四、典型应用

  • 开关电源(SMPS)整流与续流二极管
  • 适配器与充电器功率整流
  • LED 驱动电源与工业控制电源
  • 功率因数校正(PFC)电路的整流段
  • 一般高压整流、反向保护与浪涌抑制场合

五、设计与使用建议

  • 散热:尽管为表面贴装器件,连续 5A 工作时应在 PCB 上设计足够的铜箔面积与通孔散热,必要时并联或加大金属热沉以控制结温。
  • 浪涌管理:Ifsm 为非重复峰值浪涌能力,适用于启动或短时冲击,频繁或长时间浪涌请采用额外保护或并联元件。
  • 布局:将二极管靠近整流输入端并配合合适滤波器件可减少环路面积,降低 EMI。
  • 回流焊工艺:遵循通用 SMC 回流曲线,避免超过器件最大结温;回流前确保包装与贴装角度合适以利放置。
  • 测试与验证:在最终应用中应对工作温度、频率与浪涌条件进行实际验证,确保结温与电流不超限。

六、封装与合规

  • 封装形式:SMC,低外形,适合自动贴片生产线。
  • 环保合规:符合欧盟 RoHS 2011/65/EU 指令,无铅工艺。

如需完整数据手册(包含热阻、典型电路图、回流曲线与具体测试条件等),建议联系晶导微电子获取最新规格书以便在设计中准确使用 RS5GC。

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