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JSMSEMI MMBT3904
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JSMSEMI MMBT3904
- Type
- JSMSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JSMSEMI
- Electronic Component
- MMBT3904
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Electronic Component
- BM0227639670
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- NPN
- Frequency(f T)
- 300MHz
- Power Dissipation(Pd)
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBT3904（JSMSEMI）产品概述
一、概述
MMBT3904（JSMSEMI 出品）为通用小信号 NPN 晶体管，采用 SOT-23 小型表面贴装封装，适用于各类小功率开关与低噪声放大电路。器件在低电流放大与中高频响应上表现良好，是替换传统 2N3904 的常用 SMD 选型。
二、主要参数
- 晶体管类型：NPN（小信号双极晶体管）
- 直流电流增益 hFE：100 @ Ic=10mA, Vce=1V
- 集电极电流 Ic(max)：200mA
- 集电极—发射极击穿电压 Vceo：40V
- 耗散功率 Pd：250mW（封装与散热条件相关）
- 特征频率 fT：300MHz
- 集电极截止电流 Icbo：50nA
- 发射极—基极击穿电压 Vebo：6V
- 饱和电压 VCE(sat)：典型 300mV
- 工作结温范围：-55℃ ~ +150℃（Tj）
- 封装：SOT-23
- 品牌：JSMSEMI（杰盛微）
三、关键特性
- 中等电压能力（Vceo=40V），适合 5V~24V 系统的低侧开关与放大用途。
- 高频性能良好（fT≈300MHz），在 VHF 频段内可用于小信号放大和射频前端的某些低功率应用。
- 低漏电流（Icbo≈50nA），在高阻抗电路中能够保持低偏置误差。
- SOT-23 封装便于自动化贴装与高密度 PCB 设计。
四、典型应用场景
- 数字电路中的低侧开关、驱动小型继电器或指示 LED（在安全电流范围内）。
- 前置放大器与信号放大（音频、传感器信号）。
- 电平转换、缓冲、低功耗开关与脉冲驱动电路。
- 高频小信号放大或混合信号电路中的增益级。
五、封装与热管理
SOT-23 为塑封小体积封装，热阻较大。建议在 PCB 设计上：
- 增加焊盘面积极大化散热；必要时追加铜箔散热通道。
- 在连续工作或高占空比条件下，确保集电极电流与功耗不超过 Pd（250mW）。在高温环境下，应降低允许的耗散功率以保护结温。
六、设计与使用注意事项
- 为避免击穿，实际电路中 Vce 不应超过 40V，且注意瞬态峰值。
- 基极—发射极反向电压不可超过 Vebo（6V），否则可能损坏基区结。
- 在要求饱和开关时，应提供足够的基极驱动电流；通常经验值 Ib ≈ Ic/10 可作为起始参考，以保证较低的 VCE(sat)。
- 考虑到 hFE 在不同 Ic、Vce 与温度下变化，精确放大倍数应通过电路仿真与实测校准。
七、测试与替换建议
- 量产采购或电路替换时，可用常规参数（hFE、Vceo、Ic）做初步筛选，但建议依据电路实际工作点做样品测试验证增益、饱和电压与温漂性能。
- 对应 2N3904 类器件的 SMD 替代选型时，注意封装热性能与最大耗散功率的差异，必要时选用更大功率封装以保证可靠性。
本器件以其小体积、良好频率响应与通用性，适合各种中低功率、小信号应用场景。设计中请根据上列限制与建议合理选择偏置与散热措施，以保证长期稳定运行。
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