Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
JSMSEMI AMS1117-ADJ AMS1117
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JSMSEMI AMS1117-ADJ
- Type
- JSMSEMI
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 1.1V@(1A)
- Electronic Component
- JSMSEMI
- Electronic Component
- 0.003%Vout
- Electronic Component
- AMS1117-ADJ
- Electronic Component
- 1
- Package
- SOT-223-3
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.214g
- Electronic Component
- 1
- Electronic Component
- BM0227639681
- Operating Temperature
- 40℃~+125℃@(Tj)
- Operating Voltage
- 12V
- Output
- Electronic Component
- Output Voltage
- 1.25V~12V
- Output Current
- 1A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AMS1117-ADJ 产品概述
一、产品简介
AMS1117-ADJ（JSMSEMI/杰盛微）是一款高性能可调线性稳压器（LDO），提供1A的输出能力，输出电压可在1.25V到12V之间调整。器件集成热关断与过流保护，适用于对输出纹波和噪声有较高要求的单通道正向电源管理场景，工作结温范围宽（-40℃ ~ +125℃），封装为SOT-223-3，方便中低功率电路的PCB散热与安装。
二、主要特点
- 可调输出：Vout 可调范围 1.25V ~ 12V（内部参考电压 1.25V）
- 最大输出电流：1A
- 静态电流（Iq）：5mA（静态损耗低）
- 压差（Dropout）：1.1V @ 1A
- PSRR：75dB @ 120Hz（良好电源纹波抑制）
- 噪声：0.003% Vout（低输出噪声）
- 保护功能：热关断、过流保护
- 封装：SOT-223-3，便于散热与手工贴装
三、电气性能要点
- 调节公式：Vout = Vref × (1 + R2/R1) + Iadj × R2，典型 Vref = 1.25V。实用设计中常用 R1 ≈ 240Ω 来减小调节误差和噪声影响。
- 输入电压要求：为了保证额定输出电流与压差特性，输入电压应高于目标 Vout 至少压差值（例如 1A 时需高出约1.1V）。
- 功耗与热设计：芯片功耗约为 (Vin − Vout) × Iout，长时间大电流工作时需注意结温及散热，SOT-223-3需配合大铜箔散热或外部散热片。
四、典型应用
- 单轨可调电源（嵌入式开发板、电源模块）
- 微控制器和模拟前端供电（要求低纹波、低噪声场合）
- 通信、消费电子及工业控制中的局部稳压电源
- 电池管理和便携设备（需注意整体功耗与热设计）
五、封装与热管理建议
SOT-223-3 提供较好的 PCB 散热通道，建议在PCB底层扩大散热铜箔并采用通孔连接多层地平面以提升热阻性能。高输入-低输出、大电流工作时应计算结温并必要时增加散热措施。
六、设计建议与注意事项
- 输入、输出端必须并联适当的去耦电容以保证稳定性与低噪声（常用 10µF 低 ESR 输出电容）；参考器件规范选择电容类型与 ESR。
- 选择调整电阻时注意 Iadj 带来的偏差，推荐 R1 ≈ 240Ω 以降低误差。
- 当 Vin − Vout 较大且输出电流接近 1A 时，应评估功耗并采取充分散热措施，避免触发热关断。
- 在需要更高效率的场合可考虑开关电源，以减少线性稳压器的功耗与发热。
总结：AMS1117-ADJ（JSMSEMI）以简单的外围、良好的纹波抑制和可靠的保护特性，适合中小功率可调稳压场合。设计时重点关注输入电压余量、热耗与输出滤波，以保证长期稳定与可靠运行。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
