WMSIC Electronic Components

JSMSEMI IR2110STRPBF-JSM IR2110STRPBF

ModelIR2110STRPBF-JSM
PackageSOP-16
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI IR2110STRPBF-JSM
Type
SOP-16
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
IR2110STRPBF-JSM
Electronic Component
1
Package
SOP-16
Electronic Component
(UVP)
Electronic Component
Gate Driver IC
Electronic Component
0.733g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0258701772
Operating Temperature
40℃~+125℃
Operating Voltage
10V~20V
Load Type
MOSFET
Driver
Electronic Component
Current(IOH)
4A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IR2110STRPBF-JSM 产品概述

一、产品简介

IR2110STRPBF-JSM 为杰盛微(JSMSEMI)推出的半桥驱动器芯片,适用于高/低侧MOSFET门极驱动。器件工作电压范围为 10V ~ 20V,能够提供高达 4A 的拉/灌电流(IOH/IOL),上升时间典型值 25ns、下降时间典型值 17ns,具有欠压保护(UVP)功能,静态工作电流仅 120µA,工作温度范围 -40℃ ~ +125℃,封装为 SOIC-16-300mil,适合功率电子系统中的中高频开关应用。

二、主要性能亮点

  • 半桥结构,专为高/低侧MOSFET成对驱动设计;适配常见功率拓扑。
  • 强劲的瞬态驱动能力:4A 峰值拉/灌电流,兼顾开关速度与驱动能力。
  • 快速开关响应:tr ≈ 25ns,tf ≈ 17ns,适合要求较高开关频率的场合。
  • 欠压保护(UVP):有效防止门极在供电不足时误导通,提升系统可靠性。
  • 低静态电流(Iq ≈ 120µA):有利于空载或低功耗工况下的能耗控制。
  • 宽温度与商用工业级规范:-40℃ 至 +125℃ 工作温度,抗干扰与耐候性好。
  • 标准 SOIC-16 封装,便于 PCB 布局与批量生产。

三、典型应用场景

  • 电机驱动与伺服驱动器(半桥/全桥单元)
  • 逆变器、光伏并网变换器和不间断电源(UPS)控制单元
  • DC-DC 升降压转换器、高频开关电源(SMPS)
  • 有源功率因数校正(PFC)与音频类 D 类放大器

四、设计与布局建议

  • 高侧供电建议采用自举电容配合二极管的传统方案,保证高侧驱动在开关期间有稳定的驱动电压。
  • 在 VCC、VB 引脚附近放置低 ESR 的去耦电容(陶瓷),以抑制瞬态电流冲击并缩短回路。
  • 门极引脚与 MOSFET 之间建议串联适当的门极电阻,用于控制开关速度、抑制振荡并限制瞬态电流。
  • 布局时尽量缩短高电流回路(电源、源极)与驱动回路的回路面积,降低寄生电感对开关瞬态的影响。
  • 对于大电流及严苛环境,考虑在驱动输出处加阻尼或RC 滤波以抑制反射和振铃,并在系统中配置适当的电磁兼容(EMC)措施。

五、可靠性与热管理

  • 虽然器件自身静态电流低,但在高频及大电流驱动时会产生瞬态损耗,应关注系统散热与 PCB 铜箔面积。
  • 器件在高温环境下应留有充分热裕量,保证结温不超出规格上限;必要时通过改善散热或降低占空比来减轻热应力。
  • 建议在产品设计验证阶段进行热仿真与长期老化测试,以确认在实际工况下的可靠性。

六、选型与使用建议

  • 在最终选型前,结合实际MOSFET门电荷、开关频率与系统拓扑计算驱动能量与瞬态电流需求,验证 4A 驱动能力能否满足系统要求。
  • 使用前应获取完整器件资料(Datasheet)以核对引脚定义、UVP 门槛、电气时序和典型应用电路;如有批量采购或特殊封装需求,建议联系 JSMSEMI 或授权渠道确认货期与合规性。

以上为基于提供参数的 IR2110STRPBF-JSM 产品概述,供设计初期评估与方案讨论使用。

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