Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
JST B02B-XASK-1(LF)(SN)
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JST B02B-XASK-1(LF)(SN)
- Type
- JST
- Minimum package
- 1000
Technical parameters
- Electronic Component
- JST
- Electronic Component
- B02B-XASK-1(LF)(SN)
- Electronic Component
- 1
- Package
- Through-hole, P=2.5mm
- Electronic Component
- 1
- Electronic Component
- Wire-to-Board
- Electronic Component
- 0.28g
- Electronic Component
- 2.5mm
- Electronic Component
- Electronic Component
- PIN
- 2P
- Electronic Component
- 1
- Electronic Component
- XA
- Electronic Component
- BM0000004141
- Electronic Component
- PA66
- Electronic Component
- Through-hole
- Operating Temperature
- 25℃~+85℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
B02B-XASK-1(LF)(SN) 产品概述
产品名称: B02B-XASK-1(LF)(SN)
连接器类型: 线对板针座 2P 1x2P XA 插件
品牌: JST
封装类型: 通孔（Through Hole）
基础参数
B02B-XASK-1(LF)(SN)是一款高性能的连接器，广泛应用于各种电子设备中，特别是在电路板与电缆或导线之间的连接。该产品的设计使其适用于多种应用场景，特别是需要高可靠性和良好电气性能的环境。
连接器类型: 此产品为接头类型的连接器，主要用于将电缆或导线与印刷电路板（PCB）连接，确保信号或电力的有效传输。
触头类型: 采用公形引脚设计，具有出色的连接稳定性和耐用性，适合多次插拔的应用。
针位数和排数: 该连接器具有2个配接针位，单排设计，这使其在一些空间限制较大的应用中表现优异，能够有效缩小设备体积。
间距: 0.098"（2.50mm）的引脚间距，符合大多数电子设计标准，为PCB设计师提供了更灵活的布局选择。
安装类型: 采用通孔安装，简化了与PCB的连接流程，在组装过程中具备良好的定位性和稳定性。
端接方式: 支持压接和焊接两种端接方式，适应不同的组装需求和用户偏好。
材料及特性
触头材料: 触头采用铜合金制造，具有优异的导电性能和耐腐蚀性，确保长时间使用的可靠性。
触头表面处理: 配接和柱表面均采用锡处理，提供良好的焊接性能，并有效降低氧化可能性，提高长期连接性能。
绝缘材料: 采用聚酰胺（PA66），尼龙 6/6 和玻璃纤维增强型材料，赋予连接器良好的机械强度和耐热性。
绝缘高度: 0.346"（8.80mm）和接触长度0.134"（3.40mm），确保插拔时的安全性和稳定性。
工作温度范围: -25°C至85°C的工作温度范围使其能够在多种环境下稳定工作，适用于自动化设备、家电和电子消费品等领域。
材料可燃性等级: 该产品符合UL94 V-0的可燃性等级，确保在高温或短路情况下的安全性，降低火灾风险。
额定参数
额定电流: 最高可承载电流为3A，适用于大多数日常电气应用。
额定电压: 最大工作电压为250V，满足中低压电力和信号传输的需求。
应用领域
B02B-XASK-1(LF)(SN)连接器广泛应用于各类电子设备和系统，包括：
- 工业自动化控制器
- 家电设备（如洗衣机、冰箱等）
- 通信设备
- 消费电子产品（如电脑、音响等）
- 汽车电子设备
总结
B02B-XASK-1(LF)(SN)连接器凭借其卓越的电气性能、优质的材料选择及灵活的安装方式，成为现代电子设备设计中的重要选项。无论是在高需求的工业应用还是日常消费电子产品中，都能体现出其可靠性与耐用性。JST作为连接器行业的领导者，其产品经历严格的测试认证，确保满足客户的各类需求。选择B02B-XASK-1(LF)(SN)，为您的电子设计提供强大的连接解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
