Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
JST SYF-01T-P0.5A
Configuration
1 options
Configuration
21+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- JST SYF-01T-P0.5A
- Type
- JST
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- JST
- Electronic Component
- SYF-01T-P0.5A
- Electronic Component
- 1
- Electronic Component
- Terminal Block
- Electronic Component
- 0.334g
- Electronic Component
- 1
- Electronic Component
- BM0177300980
- AWG
- 20~26
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Voltage
- 300V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
- Electronic Component
- 0.13~0.5
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SYF-01T-P0.5A 胶壳端子
一、产品简介
SYF-01T-P0.5A 是一款由 J.S.T.（Japan Solderless Terminal）品牌提供的高性能胶壳端子，专为电子连接设计，广泛应用于各种电子设备的连接和通讯线路中。该产品采用高质量的铜合金材料制造，具有良好的导电性能和耐腐蚀性，是实现电气连接的理想解决方案。
二、基础参数
- 插针或插口：插口
- 触头端接：压接
- 适用线规：20-26 AWG（美国线规）
- 触头表面处理：锡镀层
- 材料：镀锡铜合金
- 封装方式：卷装（Reel）
三、设计与构造
SYF-01T-P0.5A 端子采用胶壳设计，具有良好的机械强度和抗拉拔能力，适合在震动和冲击频繁的环境中使用。其压接端设计能够与导线牢固连接，确保高效的电流传输。在连接过程中，压接能够提供稳固的接触和持久的连接性能，相比焊接方式，省去了焊接工序，提升了生产效率。
四、材料特性
使用的铜合金材料提供了优异的导电性，能够承受较高的电流负载，适合用于各种电子产品的电源与信号连接。同时，锡镀层有效防止氧化，延长了端子的使用寿命，保证了在恶劣环境下的可靠性。这种表面处理方式不仅提高了接头的耐腐蚀性能，还降低了接触电阻，从而进一步提升了整体性能。
五、应用场景
SYF-01T-P0.5A 端子广泛应用于电子消费品、家电、通信设备、工业控制、计算机和网络设备等领域。无论是用于电源连接、信号传输还是数据交换，该端子都能满足要求，为设备提供稳定可靠的连接。
六、安装与使用
在使用 SYF-01T-P0.5A 端子时，建议采用专业的压接工具，以确保每个连接都能够达到最佳的物理和电气性能。在选择合适的线规时，20-26 AWG 的线缆能够最佳匹配该端子的设计标准，保证连接的稳固与良好的导电性。
七、优势
- 高可靠性：采用优质 材料，确保良好的电气接触及强抗拉性能。
- 适应性广：可与多种线径兼容，适应不同的电气需求。
- 耐环境能力：良好的耐腐蚀性和抗氧化性，适合多种工作环境。
- 生产简化：卷装封装设计方便生产线的高效连接，节省时间和成本。
八、总结
SYF-01T-P0.5A 胶壳端子以其优秀的材料性能和设计特点，在电子连接领域展示了极大的应用潜力。作为 J.S.T. 的产品，其品牌价值和产品质量得到了市场的广泛认可。无论是在工业应用还是消费者市场，这款胶壳端子都能提供可靠的电气连接体验，适合各种对连接稳定性和耐用性有严格要求的电子设备。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
