WMSIC Electronic Components

JST ZPDR-18V-S

ModelZPDR-18V-S
PackageP=1.5mm
BrandJST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
JST ZPDR-18V-S
Type
JST
Unit
Electronic Component
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
JST
Electronic Component
ZPDR-18V-S
Electronic Component
1
Package
P=1.5mm
Electronic Component
2
Electronic Component
(Wire-to-Board / Wire-to-Wire)
Electronic Component
0.562g
Electronic Component
1.5mm
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0264738141
Electronic Component
PBT
Operating Temperature
25℃~+85℃
Socket
2x9P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

JST ZPDR-18V-S 1.5mm间距18PIN线对板/线对线胶壳产品概述

JST ZPDR-18V-S是一款专为小间距高密度连接设计的线对板/线对线胶壳,采用2排9PIN(共18PIN)布局,1.5mm中心间距,适配工业控制、消费电子等多场景的小功率电路连接需求,具备结构紧凑、性能稳定的特点。

一、产品核心规格与结构特点

1. 基本结构参数

  • 引脚布局:2排×9PIN(18PIN),双列直插式插孔结构,无带翅设计,简化安装流程;
  • 间距规格:1.5mm中心间距,比常规2.0mm间距节省约25%安装面积,满足高密度电路设计需求;
  • 外观与材质:白色胶壳,主体采用PBT(聚对苯二甲酸丁二醇酯) 塑料,符合UL94V-0阻燃等级;
  • 连接类型:支持线对板(与板端连接器配合)、线对线(与同系列线端胶壳配合)两种方式,灵活性强。

2. 结构设计细节

胶壳内置卡扣式定位结构,可与配套端子、连接器可靠锁合,防止松动;插孔采用防呆设计,避免端子反向插入,提升安装效率与连接可靠性。

二、材料性能与环境适应性

1. 主体材料特性

PBT塑料赋予胶壳以下优势:

  • 阻燃安全:UL94V-0阻燃等级,有效降低火灾风险,满足电子设备安全规范;
  • 机械强度:耐冲击、抗变形,适应运输与安装过程中的轻微外力;
  • 耐化学性:对常见工业溶剂、润滑油耐受性较好,适合一般工业环境使用。

2. 温度与环境范围

工作温度区间为**-25℃~+85℃**,覆盖智能穿戴、车载辅助模块、工业传感器等场景的温度需求,可在低温(如冬季户外设备)与常温环境下稳定工作。

三、电气性能参数

配合JST对应端子(如ZPR系列)使用时,电气性能符合官方技术规范:

  • 额定电流:单导线最大0.5A(AC/DC),适合小功率信号与电源传输;
  • 额定电压:50V AC/DC,满足低压电路连接需求;
  • 接触可靠性:初始接触电阻≤20mΩ,信号传输无衰减;常态绝缘电阻≥1000MΩ,避免漏电;
  • 耐电压性能:可承受500V AC/DC电压(1分钟),无击穿或闪络,保障电路安全。

四、典型应用场景

由于结构紧凑、性能稳定,ZPDR-18V-S广泛应用于:

  1. 消费电子:智能手环、蓝牙耳机、便携式音箱的内部板间连接;
  2. 工业控制:小型PLC模块、传感器节点、微型电机控制单元的信号传输;
  3. 汽车电子:车载仪表盘辅助电路、中控面板小功率模块的连接(适配车载温度范围);
  4. 通信设备:小型路由器、交换机的内部子板连接,满足高密度布局需求。

五、安装与使用注意事项

  1. 端子适配:必须使用JST官方对应端子(如ZPR系列),避免非原厂端子导致接触不良或损坏胶壳;
  2. 压接工具:使用JST专用压接工具(如YHT-220系列),确保端子与导线压接尺寸符合规范;
  3. 安装方向:胶壳带定位键,需与配套连接器定位槽对齐,防止反向插入损坏端子;
  4. 环境防护:避免长期暴露在高湿度(>85%RH)或腐蚀性气体中,可搭配防水胶套(额外采购);
  5. 温度限制:不超过-25℃~+85℃工作范围,防止PBT材料变形或老化。

总结:JST ZPDR-18V-S是高性价比小间距胶壳,凭借紧凑结构、稳定性能与广泛适配性,成为消费电子、工业控制等领域小功率连接的常用选择,满足高密度电路设计核心需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.