Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
JST B3P5-VH(LF)(SN)
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JST B3P5-VH(LF)(SN)
- Type
- JST
- Minimum package
- 500 盒
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JST
- Electronic Component
- B3P5-VH(LF)(SN)
- Electronic Component
- 1
- Package
- Through-hole, P=7.92mm
- Electronic Component
- 1
- Electronic Component
- Wire-to-Board
- Electronic Component
- 1.266g
- Electronic Component
- 7.92mm
- Electronic Component
- Electronic Component
- PIN
- 3P
- Electronic Component
- 1
- Electronic Component
- VH
- Electronic Component
- BM0095164096
- Electronic Component
- PA66
- Electronic Component
- Through-hole
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
B3P5-VH(LF)(SN) 产品概述
基本信息
B3P5-VH(LF)(SN) 是一种高质量的线对板针座，属于日本JST（Japan Solderless Terminal）品牌。这种插头采用直插式设计，具有1x5P的端子排列，但实际上在结构上缺失了2个针脚，因此被称为"缺2P"配置，适用于特定的连接需求。插件的间距为3.96mm，而连接端则具有7.92mm的标准设计。
技术规格
- 封装类型: 插件
- 针脚排列: 1x5P（缺2P）
- 插头间距: 3.96 mm
- 总高度: 7.92 mm
- 材料: 高品质塑料及金属，符合RoHS标准
- 耐温范围: 通常适用的工作温度为-25°C至+85°C
应用场景
B3P5-VH(LF)(SN) 适用于广泛的电子设备和应用场景，主要包括：
消费电子: 在各种消费类电子产品（如音响、电视机和家电）中，B3P5-VH(LF)(SN)可用于连接电源和信号线，确保可靠的数据传输。
计算机及周边设备: 该元器件常用于计算机内部和外部设备的连接，比如主板与外部接口之间的连接，在确保良好接触的同时，降低信号干扰。
工业设备: 在制造设备和自动化机械中，有效地实现模块间连接，满足不同的电气和信号传输需求，确保设备的高效运作。
汽车电子: B3P5-VH(LF)(SN) 亦广泛应用于汽车电子系统，包括但不限于仪表盘、音响系统和电动窗控制等模块，提供稳定的接触和电流传输。
通信设备: 同时也被用于通信基站和网络设备的连接，以便确保数据的高效传输和稳定性。
设计特点
耐用性强: 使用优质材料制造，具有良好的抗腐蚀性和耐磨损能力，能够在多种环境下稳定工作。
易于插拔: 直插式设计使得连接和拆卸都非常方便，适合快速组装和维修维护。
可靠的电性: 该元器件具备低接触电阻、高耐压等优良电气性能，确保信号传输的清晰度和稳定性，减少系统故障的发生。
空间优化: 其紧凑的设计使其适用于空间有限的应用场景，提供了灵活的布局选项，助力设计师在产品设计中方便布线和空间管理。
总结
B3P5-VH(LF)(SN) 是一种强大而灵活的电子连接解决方案，广泛应用于消费电子、计算机、工业设备、汽车电子及通信设备等领域。凭借其出色的技术参数、耐用性以及易于操作的特性，用户能够获得卓越的连接稳定性，确保其产品在各种环境下持续可靠工作。随着电子产品的不断发展，B3P5-VH(LF)(SN) 将继续在未来的技术应用中扮演重要角色，助力推动电子行业向更高性能和更高效率发展。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
