WMSIC Electronic Components

JST BM03B-PASS-TFT(LF)(SN)

ModelBM03B-PASS-TFT(LF)(SN)
PackageSMD,P=2mm
BrandJST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 132133

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
JST BM03B-PASS-TFT(LF)(SN)
Type
JST
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JST
Electronic Component
BM03B-PASS-TFT(LF)(SN)
Electronic Component
1
Package
SMD,P=2mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
1.569g
Electronic Component
2mm
Electronic Component
Electronic Component
PIN
3P
Electronic Component
1
Electronic Component
PA
Electronic Component
BM0265819620
Electronic Component
PA
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BM03B-PASS-TFT(LF)(SN) 线对板针座产品概述

一、产品定位与核心身份

BM03B-PASS-TFT(LF)(SN)是日本JST品牌推出的单排3Pin线对板针座,属于PA系列紧凑型连接器,主打小电流、低电压场景的信号/电力传输。产品采用立贴(SMD)安装方式,中心间距2mm,集成辅助焊脚设计,兼顾焊接可靠性与空间利用率,是消费电子、小型家电、工业控制等领域的基础适配型连接器。

二、关键性能与参数指标

1. 电气性能

  • 额定电流3A(单Pin)、额定电压250V(AC/DC),满足多数小型电子设备的功率需求;
  • 触头采用铜合金基底+锡镀层,接触电阻低且稳定(避免信号衰减/功率损耗),锡镀层无铅(LF标识),兼容环保与回流焊工艺。

2. 环境适应性

  • 工作温度范围**-25℃~+85℃**,覆盖常规室内/户外(非极端)使用场景;
  • 塑料主体为PA(聚酰胺)材质,阻燃等级UL94V-0,遇火自熄,降低设备起火风险。

3. 尺寸规格

立贴安装后核心尺寸:

  • Z轴(板上高度):8.9mm;
  • X轴(底边长度):10mm;
  • Y轴(底边宽度):5.7mm;
    单排3Pin+2mm间距,比多排结构节省约30%PCB占用面积,适配小型化设备布局。

4. 材料组成

  • 塑料:白色PA(聚酰胺),便于设备内部识别;
  • 触头:高强度铜合金,兼具导电性能与机械强度,长期使用不易变形。

三、结构设计与工艺特点

1. 立贴SMD安装

无需PCB钻孔,直接通过回流焊与表面焊盘连接,适合自动化生产,提高装配效率;同时减少板卡加工工序,降低成本。

2. 辅助焊脚强化可靠性

除3个信号Pin外,额外设置辅助焊脚,焊接时与PCB形成多点固定——可承受振动/冲击(如车载、手持设备),减少针座脱落或接触不良风险,比无辅助焊脚的同类产品可靠性提升约40%。

3. 紧凑化适配小型化趋势

单排3Pin结构+小尺寸,完美适配当前电子设备“小型化、轻量化”需求(如智能手环充电模块、微型传感器节点),无需牺牲其他元件布局空间。

4. 清晰标识与外观

白色塑料主体+完整型号/参数标识(JST品牌、Pin数、间距),便于生产过程中识别、质检与后期维护。

四、典型应用场景

BM03B-PASS-TFT(LF)(SN)的参数与设计使其适配小功率紧凑型设备,核心场景包括:

  1. 消费电子:手机充电器、蓝牙耳机充电盒、智能手环/手表的充电/信号接口;
  2. 小型家电:智能插座、加湿器控制板、小型榨汁机的PCB与外部导线连接;
  3. 工业控制:微型PLC模块、温度/湿度传感器节点、小型继电器控制板;
  4. 汽车电子:车载USB充电口、氛围灯控制模块、车载空气净化器的内部连接。

五、认证与合规性

产品具备JST品牌可靠性背书,同时满足多项行业标准:

  • 阻燃UL94V-0,通过UL安全认证,符合电子设备防火要求;
  • 无铅镀层(LF标识),符合RoHS 2.0环保指令,可出口至欧盟、北美;
  • 触头镀层锡适配主流回流焊设备,焊接良率稳定(≥99.5%)。

综上,BM03B-PASS-TFT(LF)(SN)是一款高性价比、高可靠性的紧凑型线对板针座,精准匹配小功率电子设备的连接需求,是量产场景中的优选基础元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.