WMSIC Electronic Components

JUXING S2M

ModelS2M
PackageSMA(DO-214AC)
BrandJUXING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JUXING S2M
Type
JUXING
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JUXING
Electronic Component
S2M
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
General Purpose Diode
Electronic Component
0.1g
Electronic Component
1
Electronic Component
BM0265602192
Current
2A
Diode
1
Current(Ir)
5uA
(Vf)
1V@2A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S2M通用整流二极管产品概述

一、产品定位与品牌基础

S2M是一款通用型表面贴装整流二极管,由国内功率半导体厂商钜兴(JUXING)研发生产,主要面向中小功率整流场景设计,兼顾电气性能稳定性与封装小型化,是消费电子、家电、工业控制等领域的常用基础器件。钜兴作为专注功率器件的品牌,其产品以成熟工艺、高性价比为核心竞争力,S2M延续了品牌在整流二极管领域的可靠性优势。

二、核心电气参数解析

S2M的参数针对常规整流需求优化,关键指标覆盖“导通损耗、耐压能力、抗冲击性”三大核心维度:

  • 正向压降(Vf):1V@2A:导通时压降显著低于传统插件管(如1N4007约1.1V@1A),可降低导通损耗10%以上,提升低电压输出电源(如5V/12V)的效率;
  • 直流反向耐压(Vr):1kV:满足市电(220V)整流后的高压反向应力(峰值约310V),避免击穿失效;
  • 持续整流电流(Io):2A:稳定承载多数中小功率负载(如10-20W电源模块),覆盖常见消费电子与家电的功率需求;
  • 反向漏电流(Ir):5uA:反向截止时漏电流极小,减少待机损耗,提升电路长期可靠性;
  • 非重复峰值浪涌电流(Ifsm):50A:可应对开机瞬间、负载突变带来的瞬态冲击,降低器件损坏风险。

三、封装与物理特性

S2M采用SMA封装(DO-214AC),属于行业标准表面贴装封装,具备以下实用特点:

  • 尺寸紧凑:典型尺寸为4.5mm(长)×2.5mm(宽)×1.5mm(高),节省PCB空间,适配小型化电子设备(如手机充电器、迷你LED驱动);
  • 贴装便捷:适配自动化SMT生产线,生产效率高,适合批量制造;
  • 散热优化:封装结构利于热量扩散,满足2A持续电流下的散热需求,避免局部过热老化。

四、典型应用场景

结合参数与封装,S2M广泛覆盖以下场景:

  1. 消费电子电源:手机充电器、机顶盒/路由器电源模块、LED台灯驱动的整流桥或半波整流;
  2. 家电控制板:洗衣机、空调、微波炉的低压电源初级整流(市电整流后降压前环节);
  3. 工业仪器仪表:小型传感器、PLC辅助电源、工业遥控器的整流电路;
  4. LED照明驱动:小功率LED灯带、球泡灯的驱动电源整流部分。

五、产品优势与可靠性

S2M的核心竞争力体现在“性能平衡”:

  • 低损耗+高压兼顾:1kV耐压满足市电整流,1V压降减少导通损耗,适合效率敏感型设计;
  • 抗浪涌+小封装并存:50A浪涌能力应对瞬态冲击,SMA封装适配小型化趋势;
  • 可靠性稳定:低漏电流(5uA)降低反向损耗,长期工作不易老化,符合RoHS环保认证。

六、选型与替代建议

若需扩展或替代选型,需注意参数匹配:

  • 同参数贴片替代:Vishay S2M-13-F、ON Semiconductor 1N5819(注意:1N5819为肖特基,压降更低但耐压仅30V,仅适合低压场景);
  • 插件替代:1N5402(3A/1000V,DO-201AD封装),需调整PCB布局;
  • 选型关键:需确认「反向耐压≥应用场景峰值电压」(如市电整流需≥700V,S2M的1kV完全满足)、「持续电流≥负载最大电流」。

S2M作为成熟的通用整流二极管,凭借平衡的电气性能、小封装与高性价比,成为众多电子设计中的常规选择,适用于从消费电子到工业领域的多种整流需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.