WMSIC Electronic Components

JUXING SS510

ModelSS510
PackageSMA(DO-214AC)
BrandJUXING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JUXING SS510
Type
JUXING
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JUXING
Electronic Component
SS510
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
Schottky Diode
Electronic Component
0.101g
Electronic Component
1
Electronic Component
BM0265602202
Current
5A
Diode
1
Current(Ir)
10mA
(Vf)
850mV@5A
Electronic Component
65℃~+125℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS510 肖特基二极管产品概述

SS510是JUXING(钜兴)品牌推出的表面贴装肖特基势垒二极管,属于中小功率整流器件,以低正向压降、宽工作温度范围为核心优势,适配多种低电压大电流的电子电路场景,是传统插件整流管的高效替代方案。

一、产品核心身份与定位

SS510的核心功能是实现电流单向导通,设计针对低损耗、高效率整流需求优化,尤其适合对导通压降敏感的电源类电路。该器件采用SMA(DO-214AC)封装,兼顾小型化与散热性能,可满足高密度PCB设计的应用要求。

二、关键电性能参数解析

SS510的电参数直接决定其应用边界与性能表现,核心参数及意义如下:

  1. 正向压降(Vf):850mV@5A(直流正向电流下的典型值)——低压降可显著降低导通功率损耗,提升电路效率;
  2. 直流反向耐压(Vr):100V——长期反向截止电压上限,保障电路绝缘可靠性;
  3. 持续整流电流(If):5A——标准工作条件下的最大稳定正向电流,明确功率等级;
  4. 反向漏电流(Ir):10mA(额定反向电压下典型值)——漏电流控制合理,减少反向待机损耗;
  5. 工作结温范围:-65℃~+125℃——宽温范围适配极端环境(如车载、户外设备);
  6. 非重复峰值浪涌电流(Ifsm):150A——耐受短时间(如开机瞬间)大电流冲击,提升抗干扰能力。

三、封装与物理特性

SS510采用SMA(DO-214AC)表面贴装封装,具备以下特点:

  • 体积小巧:适配高密度PCB设计,适合小型化设备(如适配器、便携式电源);
  • 散热高效:封装结构利于热量传导,配合合理布线可满足5A持续电流的散热需求;
  • 工艺兼容:兼容回流焊、波峰焊,便于自动化生产。

四、典型应用场景

基于参数特性,SS510的典型应用包括:

  1. 开关电源整流:AC-DC适配器、DC-DC转换器次级整流,低Vf提升转换效率;
  2. LED驱动电源:低电压大电流LED驱动中,减少整流损耗,延长LED寿命;
  3. 车载电子:车载充电器、中控系统电源整流,宽结温适应汽车高低温环境;
  4. 小型家电:微波炉、电磁炉电源模块,耐受浪涌电流保障稳定;
  5. 通信设备:基站、路由器电源子系统,满足高密度贴装与低损耗需求。

五、品牌与可靠性保障

JUXING(钜兴)作为专业功率器件厂商,SS510具备以下可靠性优势:

  • 参数一致性:批量产品Vf、Ir波动小,减少电路调试成本;
  • 环境适应性:通过高低温循环、湿度老化测试,满足长期使用需求;
  • 质量管控:芯片制造到封装全程管控,降低失效风险。

六、选型与使用注意事项

为保障稳定工作,需注意:

  1. 持续电流不超5A,避免过载结温过高;
  2. 反向电压不超100V,防止反向击穿;
  3. 焊接遵循SMA规范(回流焊峰值≤260℃,时间≤30s);
  4. 存储干燥(湿度≤60%),避免静电损伤;
  5. 浪涌电流为非重复值,不得长期循环施加。

SS510凭借低损耗、宽温范围与小型化封装,成为中小功率整流场景的高性价比选择,可有效提升电路效率与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.