WMSIC Electronic Components

JUXING BZT52C20S

ModelBZT52C20S
PackageSOD-323
BrandJUXING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JUXING BZT52C20S
Type
JUXING
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JUXING
Electronic Component
BZT52C20S
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.028g
Electronic Component
1
(Zzk)
225Ω
(Zzt)
55Ω
Electronic Component
BM0265601778
Diode
1
Current(Ir)
100nA
Power Dissipation(Pd)
200mW
Electronic Component
18.8V~21.2V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C20S稳压二极管产品概述

BZT52C20S是JUXING(钜兴)推出的一款表面贴装齐纳稳压二极管,主打小封装、低功耗与稳定稳压特性,广泛适配消费电子、小型电源及工业控制等场景的电压稳定需求。

一、产品基本信息

BZT52C20S属于常规稳压管系列,采用SOD-323小型表面贴装封装(尺寸紧凑,适配高密度PCB布局),核心功能为反向击穿状态下提供稳定的20V基准电压,同时具备低漏电流特性,可兼顾稳压与低功耗设计。

二、核心电气参数解析

理解关键参数是选型与应用的基础,BZT52C20S的核心参数特性如下:

1. 稳压值(标称与范围)

标称稳压值为20V,实际工作范围覆盖18.8V~21.2V(误差±6%),属于中等精度稳压管——既满足多数对稳压精度要求不极端(如±5%~±10%)的场景,又避免因精度过高导致的成本上升。

2. 反向漏电流(Ir)

反向偏置时(电压低于稳压值)的漏电流仅100nA,这一参数表现优异:低漏电流意味着器件在非稳压状态下功耗极低,尤其适合电池供电的小型设备(如可穿戴设备、物联网传感器),可有效延长电池续航。

3. 最大耗散功率(Pd)

器件允许的最大功耗为200mW,结合标称稳压值可计算最大工作电流:
$I_{z_max} = P_d / V_z = 200mW / 20V = 10mA$
实际应用中需通过串联限流电阻控制工作电流,避免超过该阈值导致器件过热损坏。

4. 动态阻抗(Zzt、Zzk)

  • Zzt(测试电流下动态阻抗):55Ω:指额定测试电流(通常5mA)下,稳压值随电流变化的阻抗——数值越小表示稳压特性越稳定,55Ω在小功率稳压管中属于常规偏优水平,可保证输出电压波动小;
  • Zzk(拐点电流下动态阻抗):225Ω:拐点电流是器件刚进入稳压区的最小电流(通常1mA),此时阻抗相对较高属于正常现象(随着电流增大,阻抗会逐渐降低至Zzt水平),需注意确保工作电流不低于拐点电流以维持稳压状态。

三、封装与典型应用场景

SOD-323封装的紧凑性决定了BZT52C20S的应用偏向小型化、高密度电路,典型场景包括:

1. 小型直流电源稳压

如5V/12V电源扩展至20V输出(需串联限流电阻),为小型MCU、传感器提供稳定供电;或作为电源输出端的辅助稳压,抑制电压波动。

2. 过压保护电路

当电路电压意外升至20V以上时,二极管反向击穿导通,将电压钳位在20V左右,保护后端敏感器件(如运放、ADC)免受过压损坏。

3. 简单基准电压源

利用低漏电流特性,为低功耗电路提供20V基准(如电池供电的监测设备中,作为ADC的参考电压)。

4. 电平转换与信号钳位

在需要20V电平的电路中(如某些工业控制信号),作为电平参考或信号钳位元件,避免信号过冲。

四、关键性能优势

对比同类型小封装稳压管,BZT52C20S的核心优势在于:

  1. 低功耗适配:100nA漏电流可满足电池供电设备的低功耗需求;
  2. 紧凑布局:SOD-323封装支持高密度PCB设计,适配小型化产品趋势;
  3. 稳定可靠:动态阻抗在工作区表现稳定,稳压值范围明确,可批量替代常规稳压管;
  4. 成本可控:中等精度设计平衡了性能与成本,适合中低端消费电子与工业场景。

五、选型与使用注意事项

  1. 限流电阻计算:需根据输入电压$V_{in}$、负载电流$I_L$计算限流电阻:
    $R = (V_{in} - V_z) / (I_z + I_L)$
    其中$I_z$建议取3~5mA(高于拐点电流1mA,低于最大10mA);
  2. 焊接工艺:SOD-323封装焊接温度需控制在260℃以内(持续时间不超过5秒),避免损坏器件;
  3. 精度筛选:若对稳压精度要求高于±6%,需对批量产品进行筛选,挑选接近20V标称值的器件。

以上是BZT52C20S的核心产品概述,可根据具体应用场景进一步评估其适配性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.