Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
JUXING SF1004DS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JUXING SF1004DS
- Type
- JUXING
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JUXING
- Electronic Component
- SF1004DS
- Electronic Component
- 1
- Package
- TO-252
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.46g
- Electronic Component
- 1
- Electronic Component
- BM0265166857
- Current
- 10A
- Diode
- 1
- Current(Ir)
- 1uA@400V
- (Vf)
- 1.3V@10A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SF1004DS 产品概述
SF1004DS 为钜兴（JUXING）推出的一款快恢复、高效率整流二极管，采用 TO-252 封装，专为中高功率开关电源与整流应用设计。器件在 10A 工作电流下具有较低的正向压降和快速的反向恢复特性，适合追求高效率与可靠性的电源方案。
一、主要特性
- 独立式单个二极管，品牌：JUXING（钜兴）。
- 正向压降 Vf = 1.3V @ 10A，低导通损耗，有利于降低发热与提高转换效率。
- 直流最大反向耐压 Vr = 400V，适用于中高电压整流场合。
- 典型整流电流 If = 10A，满足高电流整流需求。
- 反向泄漏电流 Ir = 1μA @ 400V，待机与空载下损耗低。
- 反向恢复时间 Trr = 35ns，具有较快恢复能力，有利于减少开关损耗与电磁干扰（EMI）。
- 工作结温范围 -55°C ～ +150°C，耐高温能力强，可靠性高。
- 封装：TO-252（便于 PCB 安装与散热处理）。
二、典型电气参数（概要）
- 正向压降：1.3V（10A）
- 反向耐压：400V
- 直流整流电流：10A
- 反向电流：1μA（Vr=400V）
- 反向恢复时间：35ns
- 工作结温：-55 ～ +150°C
三、封装与散热建议
TO-252 封装兼顾体积与散热，推荐在 PCB 设计时：
- 增加对应焊盘铜面与过孔，连接多层散热层以降低结-壳及结-板温升；
- 在 10A 连续工作或高占空比条件下，考虑配合散热片或外挂散热铜柱；
- 合理走线以减少寄生电感，改善开关过程中电压应力与振铃。
四、适用场景
- 开关电源（SMPS）次级整流；
- 功率因数校正（PFC）整流桥或自由轮二极管；
- 充电器、电池管理与适配器输出整流；
- 逆变器、伺服驱动及中高频整流场合。
五、设计与可靠性要点
- 由于 Trr 为 35ns，器件适合数十至数百 kHz 的开关频率，但在更高频率与硬开关场合应评估开关损耗与热耗散；
- 反向恢复过程可能引起瞬态电压与 EMI，建议适当的 RC 吸收或缓冲电路以降低尖峰；
- 在高温或高电流运行时，注意器件结温不超出额定范围以保证长期可靠性。
六、选型与注意事项
- 若应用对导通损耗要求更严苛，可对比肖特基或超快恢复器件；但在 400V 耐压要求下，SF1004DS 在性能与成本间具备良好平衡；
- 订单与采购时留意封装（TO-252）与最大结温规格，确认回流焊温曲线与 PCB 可焊性要求；
- 储存与制程中避免潮湿与超温，遵循厂家包装与回流焊工艺说明以防焊接缺陷。
SF1004DS 凭借低正向压降、低反向泄漏及较短反向恢复时间，在中高电压与中大电流的整流应用中提供高效、可靠的解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
