WMSIC Electronic Components

JUXING BZT52C3V0

ModelBZT52C3V0
PackageSOD-123
BrandJUXING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JUXING BZT52C3V0
Type
JUXING
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JUXING
Electronic Component
BZT52C3V0
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.034g
Electronic Component
1
(Zzk)
600Ω
(Zzt)
95Ω
Electronic Component
BM0265601713
Diode
1
Current(Ir)
10uA@1V
Power Dissipation(Pd)
500mW
Electronic Component
2.8V~3.2V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C3V0稳压二极管产品概述

一、产品基本身份信息

BZT52C3V0是钜兴(JUXING) 品牌推出的独立式稳压二极管,属于小型化表面贴装器件,主要面向3V电压基准、过压保护等场景设计。该型号以紧凑封装和稳定的电气特性,成为消费级、工业级电路中常见的稳压元件之一。

二、核心电气参数解析

BZT52C3V0的关键参数直接决定其应用适配性,具体如下:

  1. 稳压值特性:标称稳压值为3V,实际工作范围为2.8V~3.2V,稳压精度控制在±6.7%以内,可满足多数对电压基准要求不苛刻的电路需求;
  2. 反向漏电流:反向偏置电压1V时,反向电流(Ir)仅为10μA,漏电流小意味着静态功耗低,且稳压区外的反向漏电稳定性好;
  3. 功率容量:最大耗散功率(Pd)为500mW,结合3V稳压值计算,最大允许工作电流约166mA(实际应用需留10%~20%余量,避免过载);
  4. 稳压区阻抗:稳压区动态阻抗(Zzt)为95Ω,反映稳压管工作点附近的电压-电流变化特性,阻抗越低稳压效果越稳定。

三、封装与物理特性

BZT52C3V0采用SOD-123 表面贴装封装,核心特点:

  • 尺寸小巧:典型封装尺寸1.6mm×0.8mm×0.6mm(长×宽×高),适配高密度电路板布局;
  • 安装便捷:无引脚设计,兼容回流焊、波峰焊等表面贴装工艺,焊接兼容性好;
  • 散热辅助:封装结构紧凑,虽功率容量有限(500mW),但可通过加宽PCB焊盘辅助散热,满足小功率电路需求。

四、典型应用场景

基于稳压特性与封装优势,BZT52C3V0主要应用于:

  1. 电压基准参考:为运放、ADC/DAC等电路提供稳定3V基准,保证信号采集/转换精度;
  2. 小功率过压保护:电路电压瞬态超3V时,稳压管反向击穿导通,分流多余电流保护后级敏感元件(如MCU、传感器);
  3. 便携式设备稳压:适配蓝牙耳机、智能手环等小型化设备,为低功耗模块提供稳定供电;
  4. 电平转换辅助:在3V与5V等电压域转换电路中,作为参考电平或钳位元件使用。

五、应用注意事项

为保证稳定工作,需注意:

  1. 功率余量:实际工作电流需低于150mA(留10%余量),避免超500mW耗散功率损坏器件;
  2. 焊接管控:回流焊峰值温度≤260℃,焊接时间≤5秒,避免高温破坏封装;
  3. 反向偏置:反向工作电压需在稳压值范围内,禁止长时间超额定反向电压(需参考完整 datasheet);
  4. 静电防护:遵循ESD规范,避免静电损坏半导体结构。

该型号以低成本、小体积、稳定的稳压特性,成为入门级电路中替代进口同类器件的优选方案之一。

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