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JUXING BZT52C12
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JUXING BZT52C12
- Type
- JUXING
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JUXING
- Electronic Component
- BZT52C12
- Electronic Component
- 1
- Package
- SOD-123W
- Electronic Component
- Zener Diode
- Electronic Component
- 0.033g
- Electronic Component
- 1
- (Zzt)
- 25Ω
- Electronic Component
- BM0226478987
- Diode
- 1
- Current(Ir)
- 100nA@8V
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 11.4V~12.7V
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C12（钜兴 JUXING）产品概述
一、主要参数
BZT52C12 为独立式稳压二极管，标称稳压值 12V，允许工作范围 11.4V～12.7V；最大耗散功率 Pd = 500mW；结温工作范围 -55℃～+150℃；反向漏电流 Ir = 100nA（@8.0V）；稳压阻抗 Zzt = 25Ω（在规定测试电流下）。封装：SOD-123W，品牌：JUXING（钜兴）。
二、产品特性
- 小封装表面贴装，适合空间受限设计。
- 低反向漏电流，适合高阻抗电路或微功耗场景。
- 中等稳压阻抗（Zzt=25Ω），对电流变化有一定的电压摆幅，适用于要求不是极高精度的稳压/基准场合。
- Pd 500mW，适合小功率稳压、信号钳位和参考用途。
三、典型应用
- 低功耗电源的分流稳压（作为并联稳压器）。
- 过压/钳位保护、浪涌吸收。
- 电源参考、信号钳位电路、传感器前端保护。
- 便携式设备、通信模块、工业控制低功耗端口。
四、封装与热管理
SOD-123W 为小型表贴封装，热阻较大，实际可用功率受PCB铜箔、环境温度与散热条件影响。建议在布局时增加散热铜箔并靠近地平面，避免长期接近 Pd 上限。结温不得超过 +150℃，实际设计时应做热余量和降额处理。
五、使用建议与注意事项
- 最大稳压流 Iz_max ≈ Pd / Vz。以 Vz=12V、Pd=0.5W 计，Iz_max ≈ 41.7mA。设计并联稳压电路时应保证工作电流远低于此值并留有余量。
- 串联限流电阻 R = (Vin - Vz) / Iz，根据目标 Iz 计算并考虑 Iz_max 限制与最坏工况。
- Zzt = 25Ω 表示电流变化会引起较明显的电压摆幅，若需更精确的稳压应选用低阻抗或有源稳压方案。
- 在高温或高散热阻条件下，应降低工作电流以防过热损坏。
- 焊接温度按SMD工艺规范，避免超时超温。
六、典型电路说明
基本并联稳压：Vin -> R -> 节点 -> BZT52C12(阴极) -> 地(阳极)。节点提供近 12V 的稳压输出。选择 R 时兼顾最小负载电流与最大允许 Iz，确保在输入电压和负载变化时二极管不超功耗极限。
总结：BZT52C12（钜兴）为一款适用于小功率、空间受限场合的 12V 稳压二极管，特性平衡，适合分流稳压与保护用途。设计时应重点关注热管理、稳压电流与稳压阻抗对输出精度的影响。
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