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JUXING MBR20100DT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JUXING MBR20100DT
- Type
- JUXING
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JUXING
- Electronic Component
- MBR20100DT
- Electronic Component
- 1
- Package
- TO-252
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.44g
- Electronic Component
- 1
- Electronic Component
- BM0265602200
- Current
- 20A
- Diode
- 1
- Current(Ir)
- 100uA@100V
- (Vf)
- 850mV@10A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MBR20100DT肖特基二极管产品概述
一、产品基本属性
MBR20100DT是钜兴（JUXING）品牌推出的独立式肖特基整流二极管，属于中功率肖特基器件范畴。其核心基于金属-半导体接触的单向导电机制，区别于传统硅PN结二极管，具备低正向压降、快速开关的典型特征，广泛适配中低压整流、续流等电子电路场景。
二、核心电气参数详解
该器件的关键参数直接决定了其应用边界与性能表现，具体如下：
参数名称 典型/额定值 技术意义 正向压降（Vf） 850mV@10A 正向导通时的电压损耗，比同电流快恢复二极管低15%-20%，大幅降低导通功耗。 直流反向耐压（Vr） 100V（额定） 长期可承受的反向直流电压上限，满足多数中低压电路（≤100V）的绝缘需求。 平均整流电流（If） 20A（25℃/散热良好） 连续导通的最大电流容量，是功率密度的核心指标，适配中小功率整流场景。 反向漏电流（Ir） 100μA@100V 反向截止时的漏电，数值极低，减少反向功耗与漏电导致的电路稳定性问题。 非重复峰值浪涌电流（Ifsm） 120A（8.3ms半周期） 单次浪涌冲击耐受能力，可抵御电路启动、负载突变时的电流尖峰，提升可靠性。 工作结温范围 -55℃~+150℃ 宽温覆盖工业级与车规级部分场景，适应高低温环境下的稳定运行。三、封装与物理特性
采用TO-252封装（又称DPAK），属于3脚表面贴装型封装，具备以下特点：
- 尺寸紧凑：适合高密度PCB布局，节省电路空间，适配小型化设备（如适配器、车载模块）；
- 散热优异：引脚与封装底座的热传导设计，可有效散发布尔效应产生的热量，保障高功率密度下的结温稳定；
- 环保合规：默认符合RoHS无铅无卤标准，满足绿色制造要求。
需注意：引脚定义通常为「1脚阴极、2/3脚阳极」，实际应用需参考官方 datasheet 确认。
四、典型应用场景
MBR20100DT因低损耗、快速开关特性，广泛应用于以下领域：
- 中小功率开关电源：作为二次侧整流器件，提升LED驱动电源、笔记本适配器（≤100W）的转换效率；
- 车载电子：适应宽温范围，用于车载充电系统、车灯驱动电路的续流与整流；
- 电机驱动：直流/小型交流电机控制电路的续流二极管，快速关断特性减少反向恢复损耗，提升电机响应速度；
- 光伏微型逆变器：光伏组件的整流与续流，低正向压降有助于提升光伏转换效率；
- 消费电子：平板充电器、智能家居设备的电源模块，满足低功耗、小体积需求。
五、性能优势总结
- 低损耗高效：850mV@10A正向压降，减少电路发热与能量浪费，提升系统能效；
- 快速开关：无反向恢复时间（或极短），避免电流尖峰，简化EMI滤波设计；
- 抗浪涌强：120A非重复浪涌电流，降低电路启动/负载突变时的故障风险；
- 宽温可靠：-55℃~+150℃结温范围，适配严苛环境；
- 安装灵活：TO-252表面贴装封装，兼容自动化贴装与手工焊接。
该器件凭借均衡的性能与成本优势，成为中低压整流场景的高性价比选择，广泛适用于工业、消费、车载等领域的电子设计。
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