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JUXING SSL34F
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JUXING SSL34F
- Type
- JUXING
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JUXING
- Electronic Component
- SSL34F
- Electronic Component
- 1
- Package
- SMAF
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.056g
- Electronic Component
- 1
- Electronic Component
- BM0263449379
- Current
- 3A
- Diode
- 1
- Current(Ir)
- 300uA
- (Vf)
- 450mV@3A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SSL34F 产品概述
一、主要简介
SSL34F 是钜兴（JUXING）推出的高可靠性直流整流二极管，采用“SMAF”框架焊接式封装，设计用于替代传统打扁SMA与框架SMA产品。凭借框架焊接工艺，该器件在导热、机械强度与电流承载能力上具有显著优势，适用于中低压大电流整流与保护场合。
二、关键性能参数
- 二极管数量：单只独立式
- 正向压降（Vf）：典型 0.45 V @ 3 A
- 直流反向耐压（Vr）：40 V
- 连续整流电流：3 A
- 反向漏电流（Ir）：300 μA（常温、额定Vr 条件下典型值）
- 非重复峰值浪涌电流（Ifsm）：80 A（一次性峰值浪涌能力）
- 工作结温范围：-55 ℃ ~ +125 ℃
这些参数使SSL34F在3A级别功率路径与浪涌承受场景中表现稳定可靠。
三、封装与工艺优势
SMAF（框架焊接式）封装结合了金属框架与传统SMA尺寸的优点：
- 更大的焊接面积与更低的热阻，有利于热量快速传导至PCB铜箔；
- 焊接式结构提高机械强度，适合震动与热循环较多的应用环境；
- 与现有打扁SMA/框架SMA布局兼容，便于替换与工程更改。
四、典型应用场景
- 开关电源与整流模块的输出/整流回路；
- 车载电子（非高压瞬态关键处）、家用电源适配器与充电设备；
- 电机驱动、逆变/整流保护、半导体开关的续流/保护二极管；
- PCB 上需要高浪涌承受能力与良好热管理的整流位置。
五、安装与散热建议
- 建议在PCB中为阳极/阴极焊盘采用较大铜箔区域并配置热过孔以提高散热效率；
- 采用符合工艺规范的回流或波峰焊温度曲线，避免过热时间过长；
- 对于长期高电流工作场合，应评估PCB铜厚与散热片结合使用以降低结温。
六、可靠性与选型注意
- SSL34F 的框架焊接结构增强了可靠性，但在高环境温度下应注意反向漏流随温度上升的影响；
- 在选择替换器件时，请确认封装尺寸、焊盘布局与热性能匹配；
- 对于需要更高反向耐压或更低漏电流的场合，考虑更高Vr等级或使用低漏型二极管。
SSL34F 以其低正向压降、高浪涌承受力和优良的热机械特性，适合对电流容量与可靠性有较高要求的中低压整流应用。如需产品数据手册、封装图或推荐焊接工艺参数，可向钜兴官方渠道索取详细资料。
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