Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
JUXING DSK24
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JUXING DSK24
- Type
- JUXING
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JUXING
- Electronic Component
- DSK24
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0226441840
- Current
- 2A
- Diode
- Electronic Component
- Current(Ir)
- 500uA@40V
- (Vf)
- 550mV@2A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DSK24（钜兴）肖特基二极管 产品概述
一、产品简介
DSK24 是钜兴（JUXING）推出的一款独立式肖特基二极管，采用 SOD-123FL 封装，面向空间受限且要求低压降、高效率的电源及保护电路应用。器件在宽温范围内工作稳定，适配消费电子、通信、工业控制等多类场景。
二、主要性能参数
- 器件类型：独立式肖特基二极管
- 正向电流（整流）：2A（DC）
- 正向压降：Vf = 550mV @ 2A
- 直流反向耐压：Vr = 40V
- 反向电流：Ir = 500μA @ 40V
- 非重复峰值浪涌电流：Ifsm = 50A（非重复）
- 工作结温范围：-55℃ ~ +125℃
这些参数表明 DSK24 在中小功率整流与保护场合具有较低的导通损耗与良好的浪涌承受能力。
三、封装与热管理
SOD-123FL 为小型表面贴装封装，有利于高密度电路板设计。典型工作时沿用 Vf×I 估算结点功耗（在 2A 时约 1.1W），需结合 PCB 铜箔面积与热阻进行散热设计。建议在高功率或连续工作场景下增大焊盘面积、使用过孔或热铜平面以降低结温，保证长期可靠性。
四、典型应用
- 开关电源次级整流与同步整流替代
- DC-DC 转换器自由轮回路与输出整流
- 逆向保护、反接保护电路
- LED 驱动及电池充放电保护
- 汽车电子（非高耐压主回路）、工业控制模块等
五、使用与可靠性建议
- 反向漏电随温度上升会增加，设计时应考虑高温下的 Ir 对系统待机功耗的影响；高温环境下需验证实际漏电。
- Ifsm 为非重复浪涌能力，对于重复冲击或脉冲工作需参考完整数据表并进行实验验证。
- 焊接建议遵循厂商推荐的回流温度曲线与 ESD 防护规范，避免过热导致性能退化。
- 在苛刻环境（高湿、高温或强振动）使用前建议进行加速老化与可靠性测试。
六、订购与技术支持
如需器件样品、详细电气参数曲线或封装尺寸图，请联系钜兴（JUXING）或其授权分销渠道获取完整数据手册。对于特定应用的热仿真与布局优化，建议提供工作条件以便工程支持进一步建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
