Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
JJW JST137K-800E JST137K
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JJW JST137K-800E
- Type
- JJW
- Minimum package
- 2500
Technical parameters
- Electronic Component
- JJW
- Electronic Component
- JST137K-800E
- Electronic Component
- 1
- Package
- TO-252
- Electronic Component
- Thyristor (SCR) / Module
- Electronic Component
- 0.463g
- Electronic Component
- 1
- Electronic Component
- BM0257700905
- Operating Temperature
- 40℃~+125℃
- Surge Current
- 65A
- Latching Current(Ih)
- 25mA
- Current(It)
- 8A
- Electronic Component
- 2500
- Voltage(Vtm)
- 1.65V
- Gate Voltage(Vgt)
- 1.5V
- Gate Current(Igt)
- 70mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
JST137K-800E 可控硅（SCR）产品概述
一、产品简介
JST137K-800E 是捷捷微（JJW）生产的一款功率可控硅，封装为 TO-252（DPAK），面向中高压整流、相位控制及保护电路等场合。器件具备 800V 的反向重复峰值阻断能力和 8A 的额定通态电流，兼顾高压耐受与中等功率处理能力，适用于开关整流与交流负载控制等工业与消费类电源应用。
二、主要电气参数
- 门极触发电压 Vgt：1.5V（低触发电压，易驱动）
- 门极触发电流 Igt：70mA（一般驱动电路可直接驱动或通过门电阻限制）
- 保持电流 Ih：25mA（需保证触发后电流不低于此值以维持导通）
- 断态峰值电压 Vdrm：800V（适合高压工况）
- 通态峰值电压 Vtm：1.65V（在指定测试电流下的压降，影响功耗）
- 通态电流 It：8A（连续额定电流，需良好散热）
- 浪涌电流：65A（非重复峰值，适应启动或短时冲击）
- 门极平均耗散功率 PG(AV)：500mW
- 工作温度范围：-40℃ 至 +125℃
三、性能与优点
- 低门极触发电压（1.5V）和适中的触发电流，便于与逻辑或小功率驱动电路配合。
- 800V 的耐压能力满足多数中高压电源及工业控制需求。
- TO-252 封装兼顾体积与散热性能，便于表面贴装自动化生产。
- 较高的浪涌承受能力（65A）增强了抗冲击与启动能力。
四、典型应用场景
- 交流相位控制（灯光调光、电机速控）
- 高压整流与逆变保护电路（功率因数校正前端、整流器）
- 恒流/限流电源、过压/过流自保护（钳位、crowbar）
- 工业控制、家电以及电池充电电路中的开关元件
五、封装与散热建议
TO-252（DPAK）为平贴式功率封装，建议在 PCB 上配置大面积铜箔散热区域并通过多个过孔连接至底层散热层，以降低结壳温升。在持续 8A 工作条件下，应对通态压降所产生的损耗进行计算并采用合适散热设计；必要时增加外部散热片或采用多片并联（注意门极隔离与均流措施）。
六、使用注意事项与可靠性
- 需注意门极最大耗散（PG(AV) 500mW），避免长时间高门极驱动。建议在门极串联适当阻值并加 RC 抑制以抵御干扰。
- 对于高 dv/dt 环境建议并联 RC 抑制或增加栅极保护，以防误触发。
- 在浪涌和重复峰值条件下遵循器件数据手册的非重复/重复能量限制并配合合适保险与保护元件。
- 工作温度范围内使用，并在高温时考虑电气参数退化与必要的降额设计。
七、订购信息
型号：JST137K-800E，品牌：JJW（捷捷微），封装：TO-252。如需技术资料（完整的电气特性曲线、热阻、典型波形图）及可靠性数据，请联系供应商或索取器件的详细数据手册以指导实际设计与认证测试。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
