WMSIC Electronic Components

JJW JMTL3N10A

ModelJMTL3N10A
PackageSOT-23
BrandJJW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JJW JMTL3N10A
Type
JJW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JJW
Electronic Component
JMTL3N10A
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.042g
Electronic Component
1
Electronic Component
BM0257710613
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
2.5W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

JMTL3N10A 产品概述

一、产品简介

JMTL3N10A 是捷捷微(JJW)推出的一款高压小封装 N 沟道功率 MOSFET,采用 SOT-23 封装,面向空间受限且需要耐压能力的开关应用。器件的额定漏源电压为 100V,适合中等电压、低到中等电流的功率切换场景,如开关电源、负载开关、电机驱动及保护电路等。

二、关键电气参数

  • 类型:N 沟道 MOSFET(增强型)
  • 漏源耐压 Vdss:100V
  • 连续漏极电流 Id:3A
  • 导通电阻 RDS(on):310 mΩ @ Vgs = 10V
  • 耗散功率 Pd:2.5W(封装与 PCB 散热条件影响显著)
  • 阈值电压 Vgs(th):约 3V @ Id = 250µA
  • 总栅极电荷 Qg:5.2 nC @ Vgs = 10V
  • 输入电容 Ciss:190 pF @ 50V
  • 反向传输电容 Crss(Miller):13 pF @ 50V
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOT-23

三、主要特性与优势

  • 高耐压:100V 的耐压使其能胜任汽车电子、工业控制等含较大电压应力的场合(需配合合适的抑制元件)。
  • 小封装与小体积:SOT-23 适合空间受限的 PCB 布局,便于密集布线和成本控制。
  • 适中导通电阻:在 Vgs=10V 时 RDS(on)=310mΩ,适合 1–3A 的开关或低功率功率管理场合。
  • 小栅极电荷与输入电容:Qg=5.2nC、Ciss=190pF,有利于降低栅极驱动能耗与提高开关速度,但 Crss 仍需关注 Miller 效应对开关过渡的影响。

四、典型应用场景

  • 低压侧(low-side)负载开关:用于灯、继电器、加热器等负载的开/关控制。
  • 开关电源与降压转换器:适合小功率 DC-DC 或外围开关器件(注意栅极驱动与散热)。
  • 反向电池保护与电源管理:用于串联断开或反接保护。
  • 小型电机驱动、步进驱动的开关级或保护器件。
  • 工业与仪表应用中对体积和成本敏感的电源开关。

五、驱动与开关性能注意事项

  • 驱动电压:RDS(on) 标称值是在 Vgs=10V 条件下给出;若仅使用 5V 或 3.3V 驱动,导通电阻会显著增加,导通损耗上升。若需低损耗导通,建议采用接近 10V 的栅极驱动或专用驱动芯片/栅极升压措施。
  • 栅极驱动能力:Qg=5.2nC,开关频率升高时栅极驱动电流与能耗增加;栅极驱动器需能提供相应的峰值电流以控制上升/下降时间。为抑制振铃与限流,常串联 10–100Ω 的门阻。
  • Miller 效应:Crss=13pF,在快速切换时会导致电压回升与延迟,尤其在高 dv/dt 环境下需注意误触发或过渡功耗。对感性负载应配合续流二极管或 RC 吸收网络。

六、热管理与封装建议

  • SOT-23 封装的散热能力有限,器件 Pd=2.5W 的标称耗散在理想条件下成立。实际应用中应通过增加 PCB 铜箔面积、铺设散热面或使用散热通孔改善结到环境的热阻。
  • 连续接近 3A 的工作电流时须评估温升与 RDS(on) 随温度的上升带来的额外损耗,必要时降低占空比或使用并联器件/更大封装器件。

七、选型与工程注意要点

  • 若系统仅有 3.3V 或 5V 逻辑电平驱动且要求低导通损耗,建议选择专为低 Vgs 优化(logic-level,RDS(on) 在 4.5V 或 2.5V 标定)的 MOSFET;JMTL3N10A 更适合用在可以提供较高栅压的场合。
  • 对于感性负载,务必在器件两端配置合适的续流或钳位元件(肖特基、TVS、RC 吸收)以限制瞬态电压。
  • PCB 布局:栅极回路短而直,漏极与源端大面积铜箔,必要时在源端附近设置热沉或铜柱提高散热。

八、可靠性与合规性

  • 工作温度范围 -55℃ 至 +150℃,满足多数工业环境的温度要求;长期可靠性取决于实际电流、功率及热循环情况。
  • 作为中高压小功率 MOSFET,适合在受限空间、成本敏感的产品中作为开关或保护器件使用。

总结:JMTL3N10A 在 SOT-23 小封装下提供了 100V 耐压、适中的导通电阻和较小的栅极电荷,适合中小功率的高压开关场合。选型时重点关注栅极驱动电压、散热条件及对感性负载的抑制措施,以保证可靠、低损耗的工作状态。

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