WMSIC Electronic Components

JJW JMSL0406AGQ-13 JMSL0406AGQ

ModelJMSL0406AGQ-13
PackagePDFN5x6-8L
BrandJJW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JJW JMSL0406AGQ-13
Type
JJW
Minimum package
5000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JJW
Electronic Component
JMSL0406AGQ-13
Electronic Component
1
Package
PDFN5x6-8L
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.184g
Electronic Component
1
Electronic Component
BM0257491742
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
75W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
40V
Capacitor(Ciss)
1.204nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

JMSL0406AGQ-13 产品概述

一款由捷捷微(JJW)推出的高性能N沟道功率MOSFET——JMSL0406AGQ-13,针对中低压高电流开关应用进行了优化。器件在40V电压等级下提供优异的导通能力和快速开关性能,适合DC-DC变换、同步整流、负载开关与高效率功率管理场景。

一、概述与核心参数

  • 器件类型:单个 N 沟道功率MOSFET
  • 漏源额定电压 Vdss:40 V
  • 连续漏极电流 Id:90 A
  • 导通电阻 RDS(on):1.6 mΩ @ Vgs = 10 V
  • 耗散功率 Pd:75 W
  • 阈值电压 Vgs(th):1.6 V
  • 总栅极电荷 Qg:1.2 nC @ Vgs = 10 V
  • 输入电容 Ciss:1.204 nF
  • 输出电容 Coss:536 pF
  • 反向传输电容 Crss:51 pF
  • 工作温度范围:-55 ℃ ~ +175 ℃
  • 封装:PDFN5x6-8L
  • 品牌:捷捷微(JJW)

二、主要特性与优势

  • 低导通电阻:在10 V栅压下,1.6 mΩ 的低RDS(on)可显著降低导通损耗,使器件在高电流条件下效率更高、发热更小,适合大电流路径。
  • 高电流承载能力:90 A 的连续漏极电流能力,结合PDFN紧凑封装,适合对电流密度要求高的场合。
  • 低栅极电荷与快速开关:Qg = 1.2 nC(10 V)表明驱动能量需求低,有利于提高开关速度并减少栅极驱动损耗,适用于高频开关电路。
  • 合理的寄生电容配置:Ciss、Coss、Crss 的组合,提供良好的开关特性和平衡的dv/dt响应,便于在转换器设计中进行调校。
  • 宽工作温度:-55 ℃ 至 +175 ℃ 的额定温度范围,增强了在恶劣环境下的适应性和可靠性。

三、典型应用场景

  • 同步整流(同步降压转换器)
  • DC-DC 垂直/板载电源模块
  • 电机驱动(作为半桥或低侧开关)
  • 负载开关与电源保护
  • 汽车电子(车载电源管理、辅助电源)——注:使用前请确认符合汽车级认证与分级要求

四、热管理与封装说明

  • 封装为 PDFN5x6-8L,具备较小的PCB占用面积与良好的散热通路。建议在PCB设计中利用底部散热焊盘并连接大面积铜箔或散热槽,以降低结到环境的热阻,提高热耗散能力。
  • Pd = 75 W 给出的是器件耗散能力的参考值,实际可耗散功率受PCB散热、环境温度及工作频率等影响。在高电流或高占空比条件下,需进行热仿真与实际温升验证,并进行必要的热降额设计。

五、驱动与PCB布局建议

  • 栅极驱动:尽管阈值电压 Vgs(th) ~1.6 V,相比逻辑电平门槛较低,但为了获得标称的RDS(on)值,应采用充足的栅压(如10 V)。若驱动电压为5 V,请在数据手册中确认相应RDS(on)特性。
  • 栅极电荷较小,有利于减小驱动器输出能力要求,但在高速切换时仍建议在栅极串入小阻(如数Ω到几十Ω)以抑制振铃并控制开关滞回。
  • 电源去耦:在功率开关节点附近放置低ESR的陶瓷电容以降低dv/dt与电压尖峰。
  • 布局要点:尽量缩短高电流回路的走线,优化源脚与电感、电容的布局,减小回路电感和寄生阻抗,提升效率并抑制EMI。

六、可靠性与使用注意

  • 工作温度范围宽,但在高温条件下器件性能会发生变化,请做好热降额及寿命评估。
  • 使用中须严格遵守器件最大额定值(如最大Vgs、峰值电流、脉冲能量等),详见厂方完整数据手册。
  • 焊接与存储需遵循厂方推荐的PCB焊接工艺与防潮处理,避免因为回流或再流超温影响器件可靠性。
  • 推荐在设计早期进行寿命及热循环测试,以评估实际应用中的稳定性。

七、选型提示与结论

JMSL0406AGQ-13 以其低RDS(on)、高电流能力与低栅极电荷的组合,适合追求高效率与紧凑布局的中低压开关应用。选型时建议结合系统工作电压、开关频率、驱动电平和散热条件进行综合评估;如需更详细的极限参数、SOA、热阻等,请参考厂方完整数据手册或联系捷捷微技术支持获取进一步资料。

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