WMSIC Electronic Components

JJW JEB4V5D3U

ModelJEB4V5D3U
PackageSOD-323
BrandJJW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JJW JEB4V5D3U
Type
JJW
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JJW
Electronic Component
JEB4V5D3U
Electronic Component
1
Package
SOD-323
Electronic Component
Electronic Component
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.037g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
600pF
Electronic Component
BM0257732260
Voltage
18V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
1uA
Voltage(VBR)
6.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

JEB4V5D3U 产品概述

一、产品简介

JEB4V5D3U 是捷捷微(JJW)推出的一款单路双向瞬态电压抑制器(TVS),采用紧凑的 SOD-323 封装,专为对抗瞬态过压和静电放电而设计。器件在低电压工作点下具有良好的击穿保护能力和高脉冲吸收能力,适用于需要单端或差分线级保护的便携设备与接口电路。

二、主要电气参数

  • 极性:双向(Bidirectional),适用于交流/差分或双向保护场合
  • 反向截止电压 Vrwm:4.5 V(工作钳位/稳态耐受电压)
  • 击穿电压 Vbr:6.5 V(器件进入导通的典型击穿点)
  • 钳位电压 Vc:≈18 V(在规定脉冲测试条件下的典型钳位电压,实际值随测试电流变化)
  • 峰值脉冲功率 Ppp:2 kW @ 8/20 μs(单次脉冲能量吸收能力强)
  • 反向电流 Ir:≤1 μA(在额定反向电压条件下的漏电流,低漏电有利于系统静态功耗控制)
  • 结电容 Cj:600 pF(较高的结电容,对高速差分或高频信号的影响需评估)
  • 通道数:单路(单芯片单通道保护)
  • 防护等级/符合标准:IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT/脉冲群)、IEC 61000-4-5(浪涌)

三、主要特性与优势

  • 高脉冲吸收能力:2 kW@8/20 μs 的峰值脉冲功率保证器件能承受工业级浪涌与瞬态事件,提升系统可靠性。
  • 双向保护:双向结构无需外加反向二极管,适合差分信号线、AC线路或可正负摆动的接口电路。
  • 低漏电流:≤1 μA 的低反向电流有助于节省待机功耗,适用于便携与电池供电设备。
  • 紧凑封装:SOD-323 小体积,便于在有限空间内完成保护布局,适合移动设备与消费电子的小型化设计。
  • 工业级兼容性:满足 IEC 61000 系列抗扰度要求,适合需通过电磁兼容(EMC)测试的产品设计。

四、适用场景

  • 接口保护:USB(非高速差分需评估电容影响)、UART、I2C、RS-232 等外部数据线与信号线保护。
  • 电源与充电线防护:对 5V 级别的供电线路提供浪涌抑制与瞬态保护。
  • 通信设备:用于基站、路由器、交换机等外围接口的过压抑制(需根据结电容与信号带宽权衡)。
  • 工业与楼宇设备:满足 EFT/浪涌与静电保护要求的工业接口防护。
  • 便携式消费电子:智能手表、移动终端、蓝牙配件等有空间与功耗限制的场合。

五、封装与可靠性

  • 封装形式:SOD-323,适合自动贴装与回流焊工艺。小型封装带来布局便利,但在高能脉冲下热耗散能力受限,设计时需留意能量分散与散热路径。
  • 品牌与质量:捷捷微(JJW)品牌,符合工业与消费电子应用的品质要求。器件通过常见抗扰度标准认证,可用于需要通过 EMC/ESD 验证的产品。

六、使用建议与 PCB 布局注意事项

  • 靠近信号入口放置:将 JEB4V5D3U 尽量靠近连接器或信号进入点放置,以缩短未保护段的走线长度,降低感性耦合带来的抗扰风险。
  • 短、粗的接地回路:器件的接地回路应尽可能短且多走地铜,若为外壳接地,确保良好连接以便迅速泄放能量。
  • 与串联元件配合:对于高频或高速信号,考虑与串联电阻或滤波网络配合使用,以减小结电容对信号完整性的影响。
  • 热与能量管理:在可能承受多次大能量脉冲的场合,评估整体能量吸收策略,必要时采用并联或更高功率等级的 TVS 以分散热量。
  • 测试验证:在目标系统中进行 ESD、EFT 与浪涌实测,以确认在实际工作条件下的钳位电压和残余电压是否满足系统安全要求。

七、典型应用电路参考

  • 单端数据线保护:数据线一端接 JEB4V5D3U 的两端,另一端接系统信号;当瞬态出现时,器件在两端间快速导通钳位电压,保护下游电路。
  • 电源侧保护:在 5V 供电线上并联布置,用于抑制不规则浪涌与高能脉冲对电源与后级芯片的损害。

结语:JEB4V5D3U 以其双向保护、2 kW 峰值脉冲吸收能力和紧凑 SOD-323 封装,适合用于对中低电压接口与电源线进行抗瞬态与静电保护的应用。选型时请结合目标信号带宽与结电容(600 pF)对系统性能的影响进行验证,以确保在保护能力与信号完整性之间取得最佳平衡。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.