WMSIC Electronic Components

Kingbright APT1608SURCK

ModelAPT1608SURCK
Package0603
BrandKingbright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Kingbright APT1608SURCK
Type
KINGBRIGHT
Unit
Electronic Component
Minimum package
2000 编带

Technical parameters

Power
75mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KINGBRIGHT
Electronic Component
APT1608SURCK
Electronic Component
1
Package
0603
Electronic Component
630nm
Electronic Component
LEDDiode / LED
Electronic Component
0.036g
Electronic Component
1
LED
230mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0229963354
Electronic Component
645nm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

APT1608SURCK 产品概述

一、产品简介

APT1608SURCK 为 Kingbright 系列 0603(1608)封装红色贴片 LED 芯片,透明透镜设计,发光颜色为红色。凭借微小体积与稳定光学输出,适合消费电子、指示灯、背光与精密显示等对体积和亮度有要求的场合。

二、主要特性

  • 发光颜色:红色
  • 波长(典型):630 nm,峰值波长 645 nm
  • 透镜颜色:无色透明
  • 发光角度:120°(宽角)
  • 小外形:0603(1608)表贴,适合高密度 PCB 设计
  • 工作温度:-40℃ ~ +85℃

三、电气与光学参数(关键值)

  • 正向电流 If(额定):20 mA
  • 正向电压 Vf(典型):1.95 V
  • 功率耗散:75 mW
  • 发光强度:230 mcd(典型)
    以上为典型和额定参考值,实际设计时请按最大额定值和应用环境进行适当余量设计。

四、封装与机械特性

0603(1608)封装,尺寸约 1.6 × 0.8 mm,体积小、重量轻,便于自动贴装。透明透镜有利于色彩纯度与光通量输出,120°的宽视角适合宽范围可视指示。具体焊盘尺寸与极性标识请参考 Kingbright 正式数据手册。

五、使用建议与电路设计

  • 建议工作电流:常用驱动为 5–20 mA,长期使用建议低于额定值以提高寿命。
  • 限流设计公式:R = (Vs − Vf) / If,例如:
    • Vs = 5 V 时,R ≈ (5 − 1.95) / 0.02 ≈ 152 Ω(可选标准 150 Ω)
    • Vs = 3.3 V 时,R ≈ (3.3 − 1.95) / 0.02 ≈ 68 Ω
  • 若需脉冲驱动或提高亮度,请确保峰值电流与占空比在器件允许范围内,并控制结温。

六、焊接与工艺注意事项

  • 建议按无铅回流工艺处理,峰值温度不超过 260℃ 且峰值时间短(数据手册有具体曲线为准)。
  • 避免在回流或手工焊接过程中对 LED 施加过大机械应力或过热,以防造成光衰或电性能下降。
  • 贴装前后注意防潮、防静电,储存和贴装过程中建议佩戴防静电防护。

七、可靠性与储存

  • 芯片对 ESD 敏感,建议在生产和测试环节实施 ESD 控制(例如使用接地腕带、抗静电台面)。
  • 长期高温或过流会加速光衰,设计时应考虑热量分散与电流降额。
  • 储存建议遵循干燥箱或原厂防潮包装,若开封后建议在规定时间内完成贴装。

八、典型应用

适用于状态指示、信号反馈、键盘背光、仪器仪表指示灯、消费电子与车载(需确认车规级要求)等场景,尤其适合空间受限且需要宽视角的设计。

如需更详细的机械尺寸、焊盘推荐、完整电气特性曲线与可靠性测试数据,请参阅 Kingbright 官方数据手册或联系供应商获取原厂资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.